CY7C1371D-100AXCT Cypress Semiconductor Corp, CY7C1371D-100AXCT Datasheet - Page 10

CY7C1371D-100AXCT

CY7C1371D-100AXCT

Manufacturer Part Number
CY7C1371D-100AXCT
Description
CY7C1371D-100AXCT
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1371D-100AXCT

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
18M (512K x 36)
Speed
100MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1371D-100AXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Pin Definitions
Functional Overview
The CY7C1371D/CY7C1373D is a synchronous flow through
burst SRAM designed specifically to eliminate wait states during
write-read transitions. All synchronous inputs pass through input
registers controlled by the rising edge of the clock. The clock
signal is qualified with the clock enable input signal (CEN). If
CEN is HIGH, the clock signal is not recognized and all internal
states are maintained. All synchronous operations are qualified
with CEN. Maximum access delay from the clock rise (t
6.5 ns (133-MHz device).
Accesses can be initiated by asserting all three chip enables
(CE
enable (CEN) is active LOW and ADV/LD is asserted LOW, the
address presented to the device is latched. The access can
either be a read or write operation, depending on the status of
the write enable (WE). BW
operations.
Write operations are qualified by the write enable (WE). All writes
are simplified with on-chip synchronous self-timed write circuitry.
Three synchronous chip enables (CE
asynchronous output enable (OE) simplify depth expansion. All
operations (reads, writes, and deselects) are pipelined. ADV/LD
must be driven LOW after the device has been deselected to
load a new address for the next operation.
Single Read Accesses
A read access is initiated when these conditions are satisfied at
clock rise:
The address presented to the address inputs is latched into the
address register and presented to the memory array and control
logic. The control logic determines that a read access is in
progress and allows the requested data to propagate to the
output buffers. The data is available within 6.5 ns (133-MHz
Document Number: 38-05556 Rev. *I
TDO
TDI
TMS
TCK
NC
CEN is asserted LOW
CE
The write enable input signal WE is deasserted HIGH
ADV/LD is asserted LOW.
Name
1
, CE
1
, CE
2
, CE
2
, and CE
synchronous
synchronous
synchronous
3
JTAG serial
JTAG serial
JTAG serial
) active at the rising edge of the clock. If clock
output
JTAG-
clock
input
input
IO
3
(continued)
are all asserted active
X
can be used to conduct byte write
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG
feature is not being used, this pin must be left unconnected. This pin is not available on TQFP
packages.
Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not
being used, this pin can be left floating or connected to V
not available on TQFP packages.
Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK. If the JTAG feature is not
being used, this pin can be disconnected or connected to V
packages.
Clock input to the JTAG circuitry. If the JTAG feature is not being used, this pin must be
connected to V
No connects. Not internally connected to the die. NC/(36 M, 72 M, 144 M, 288M, 576M, 1G)are
address expansion pins and are not internally connected to the die.
1
, CE
SS
2
. This pin is not available on TQFP packages.
, CE
3
) and an
CDV
) is
device) provided OE is active LOW. After the first clock of the
read access, the output buffers are controlled by OE and the
internal control logic. OE must be driven LOW in order for the
device to drive out the requested data. On the subsequent clock,
another operation (read/write/deselect) can be initiated. When
the SRAM is deselected at clock rise by one of the chip enable
signals, its output is tri-stated immediately.
Burst Read Accesses
The CY7C1371D/CY7C1373D has an on-chip burst counter that
allows the user the ability to supply a single address and conduct
up to four reads without reasserting the address inputs. ADV/LD
must be driven LOW to load a new address into the SRAM, as
described in the
sequence of the burst counter is determined by the MODE input
signal. A LOW input on MODE selects a linear burst mode, a
HIGH selects an interleaved burst sequence. Both burst
counters use A
when incremented sufficiently. A HIGH input on ADV/LD
increments the internal burst counter regardless of the state of
chip enable inputs or WE. WE is latched at the beginning of a
burst cycle. Therefore, the type of access (read or write) is
maintained throughout the burst sequence.
Single Write Accesses
Write access are initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE
and CE
asserted LOW. The address presented to the address bus is
loaded into the address register. The write signals are latched
into the control logic block. The data lines are automatically
tri-stated regardless of the state of the OE input signal. This
allows the external logic to present the data on DQs and DQP
On the next clock rise the data presented to DQs and DQP
a subset for byte write operations, see truth table for details)
inputs is latched into the device and the write is complete.
Additional accesses (read/write/deselect) can be initiated on this
cycle.
The data written during the write operation is controlled by BW
signals. The CY7C1371D/CY7C1373D provides byte write
capability that is described in the truth table. Asserting the write
Description
3
are all asserted active, and (3) the write signal WE is
0
and A
Single Read Accesses
DD
DD
through a pull up resistor. This pin is
1
. This pin is not available on TQFP
in the burst sequence, and wraps around
section above. The
CY7C1371D
CY7C1373D
Page 10 of 33
1
, CE
X
(or
X
2
X
[+] Feedback
,
.

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