AM29LV641DH120REF Spansion Inc., AM29LV641DH120REF Datasheet - Page 57

• Manufacturer Part Number: AM29LV641DH120REF
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29LV641DH120REF

• Memory Size: 64Mbit
• Memory Configuration: 4M X 16
• Ic Interface Type: Parallel
• Access Time: 120ns
• Memory Case Style: TSOP
• No. Of Pins: 48
• Operating Temperature Range: -40°C To +85°C
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision C + 1 (October 14, 2004)
Ordering Information
Added t
Corrected description of Sector Erase Command Se-
quence on page 30.
Added Colophon
Revision C + 2 (January 7, 2005)
Valid Combinations
Updated table to include a note regarding product of-
ferings for new designs.
Revision C + 3 (February 9, 2005)
Pin Description
Added RFU to the list of pins.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-
tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-
templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 1999–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trade-
marks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006–2007 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations
thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
January 22, 2007 22366C6
RH
reference line to Figure 14.
Am29LV640D/Am29LV641D
D A T A
S H E E T
Global
Removed references to byte mode.
Revision C + 4 (September 13, 2005)
Valid Combinations
New option FF added on TSOP and SSOP packages.
Revision C5 (December 23, 2005)
Global
Deleted reverse TSOP package option and 100 ns
speed option.
Revision C6 (January 22, 2007)
AC Characteristics
Erase and Program Operations table: Changed t
to a maximum specification.
BUSY
55