ADSP-21261SKBCZ150 Analog Devices Inc, ADSP-21261SKBCZ150 Datasheet - Page 38

• Manufacturer Part Number: ADSP-21261SKBCZ150
• Description: 150 MHz, 32Bit DSP Processor
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Fixed/Floating Pointr

Specifications of ADSP-21261SKBCZ150

• Interface: DAI, SPI
• Clock Rate: 150MHz
• Non-volatile Memory: ROM (384 kB)
• On-chip Ram: 128kB
• Voltage - I/o: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 136-CSPBGA
• Device Core Size: 32/40Bit
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 128KB
• Program Memory Size: 384KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 136
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ADSP-21261
ENVIRONMENTAL CONDITIONS
The ADSP-21261 processor is rated for performance over the
commercial temperature range, T
THERMAL CHARACTERISTICS
Table 32
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883. All measure-
ments use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
T
package
Ψ
typical value from the tables below
P
Values of θ
design considerations. θ
mation of T
where:
T
D
J
CASE
A
JT
= junction temperature (°C)
= power dissipation. See EE Note No. EE-216
= ambient temperature (°C)
= junction-to-top (of package) characterization parameter =
= case temperature (°C) measured at the top center of the
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
and
–
–
–
–
7
6
4
0
5
3
2
1
1
2
3
4
JA
J
0
by the equation:
are provided for package comparison and PCB
Table 33
T
20
J
T
y = 0.0904x - 2.712
(at Ambient Temperature)
=
J
airflow measurements comply with
=
JA
T
LOAD CAPACITANCE (pF)
CASE
can be used for a first-order approxi-
T
40
A
+
+
(
θ
(
AMB
Ψ
JA
60
JT
×
= 0°C to 70°C.
×
PD
PD
)
80
)
100
Rev. 0 | Page 38 of 44 | March 2006
120
Values of θ
design considerations when an external heat sink is required.
Table 32. Thermal Characteristics for 136-Ball BGA
1
Table 33. Thermal Characteristics for 144-Lead LQFP
1
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
Parameter
θ
θ
θ
θ
Ψ
Ψ
Ψ
The thermal characteristics values provided in this table are modeled values.
The thermal characteristics values provided in this table are modeled values.
JA
JMA
JMA
JC
JA
JMA
JMA
JC
JT
JMT
JMT
JT
JMT
JMT
JC
are provided for package comparison and PCB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1
1