ADSP-21060CZ-160 Analog Devices Inc, ADSP-21060CZ-160 Datasheet - Page 3
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ADSP-21060CZ-160
Manufacturer Part Number
ADSP-21060CZ-160
Description
Digital Signal Processor IC
Manufacturer
Analog Devices Inc
Series
SHARC®r
Type
Floating Pointr
Datasheet
1.ADSP-21062KSZ-133.pdf
(64 pages)
Specifications of ADSP-21060CZ-160
Peak Reflow Compatible (260 C)
No
Supply Voltage Max
5.25V
Dsp Type
Fixed / Floating Point
Leaded Process Compatible
No
Mounting Type
Surface Mount
Package / Case
240-MQFP
Interface
Host Interface, Link Port, Serial Port
Clock Rate
40MHz
Non-volatile Memory
External
On-chip Ram
512kB
Voltage - I/o
5.00V
Voltage - Core
5.00V
Operating Temperature
-40°C ~ 100°C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ADSP-21060CZ-160
Manufacturer:
AD
Quantity:
210
Company:
Part Number:
ADSP-21060CZ-160
Manufacturer:
AD31
Quantity:
116
Company:
Part Number:
ADSP-21060CZ-160
Manufacturer:
Analog Devices Inc
Quantity:
10 000
Part Number:
ADSP-21060CZ-160
Manufacturer:
ADI/亚德诺
Quantity:
20 000
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
CONTENTS
Summary ............................................................... 1
Key Features—Processor Core .................................... 1
Processor Features (Continued) .................................. 2
Parallel Computations .............................................. 2
Up to 4M Bit On-Chip SRAM ..................................... 2
Off-Chip Memory Interfacing ..................................... 2
DMA Controller ...................................................... 2
Host Processor Interface to 16- and 32-Bit Microprocessors 2
Multiprocessing ....................................................... 2
Serial Ports ............................................................. 2
Contents ................................................................ 3
Revision History ...................................................... 3
General Description ................................................. 4
Pin Function Descriptions ........................................ 10
REVISION HISTORY
3/08—Rev. E to Rev. F
Revised Absolute Maximum Ratings ............................
Corrected model package descriptions.
See Ordering Guide..................................................
SHARC Family Core Architecture ............................ 4
Memory and I/O Interface Features ........................... 5
Development Tools ............................................... 8
Evaluation Kit ...................................................... 9
Designing an Emulator-Compatible DSP Board (Target) 9
Additional Information .......................................... 9
Target Board Connector for EZ-ICE Probe ................ 13
Rev. F | Page 3 of 64 | March 2008
20
61
ADSP-21060/ADSP-21062 Specifications ..................... 15
ADSP-21060L/ADSP-21062L Specifications ................. 18
225-Ball PBGA Ball Configurations ............................ 51
240-Lead MQFP_PQ4/CQFP Pin Configurations ........... 53
Outline Dimensions ................................................ 55
Ordering Guide ..................................................... 61
Operating Conditions (5 V) ................................... 15
Electrical Characteristics (5 V) ................................ 15
Internal Power Dissipation (5 V) ............................. 16
External Power Dissipation (5 V) ............................ 17
Operating Conditions (3.3 V) ................................. 18
Electrical Characteristics (3.3 V) ............................. 18
Internal Power Dissipation (3.3 V) .......................... 19
External Power Dissipation (3.3 V) .......................... 20
Absolute Maximum Ratings ................................... 20
ESD Caution ...................................................... 21
Package Marking Information ................................ 21
Timing Specifications ........................................... 21
Test Conditions .................................................. 47
Environmental Conditions .................................... 50
Surface-Mount Design .......................................... 60