ADL5534ACPZ-R7 Analog Devices Inc, ADL5534ACPZ-R7 Datasheet - Page 12

• Manufacturer Part Number: ADL5534ACPZ-R7
• Description: Dual 5531
• Manufacturer: Analog Devices Inc

Specifications of ADL5534ACPZ-R7

• Design Resources: Interfacing ADL5534 to AD9640 High Speed ADC (CN0049)
• Current - Supply: 98mA ~ 110mA
• Frequency: 20MHz ~ 500MHz
• Gain: 19dB ~ 20.5dB
• Noise Figure: 3dB
• P1db: 20.4dBm
• Package / Case: 16-VQFN, 16-CSP, Exposed Pad
• Rf Type: General Purpose
• Test Frequency: 380MHz
• Voltage - Supply: 4.75 V ~ 5.25 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ADL5534ACPZ-R7TR

ADL5534
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 22 shows the recommended land pattern for ADL5534.
To minimize thermal impedance, the exposed paddle on the
package underside should be soldered down to a ground plane.
If multiple ground layers exist, they should be stitched together
using vias. Pin 1 to Pin 4, Pin 6, Pin 9 to Pin 11, and Pin 14 to
Pin 15 can be left unconnected, or can be connected to ground.
Connecting these pins to ground improves device-to-device
isolation and slightly enhances thermal impedance. For more
information on land pattern design and layout, refer to the
AN-772 Application Note , A Design and Manufacturing Guide
for the Lead Frame Chip Scale Package (LFCSP).
Rev. 0 | Page 12 of 16
3.1mm
Figure 22. Recommended Land Pattern
4.8mm
2.4mm
0.2mm
0.8mm