AD8195ACPZ-R7 Analog Devices Inc, AD8195ACPZ-R7 Datasheet - Page 5

Front Panel HDMI Buffer

AD8195ACPZ-R7

Manufacturer Part Number
AD8195ACPZ-R7
Description
Front Panel HDMI Buffer
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8195ACPZ-R7

Function
Switch
Circuit
1 x 1:1
Voltage Supply Source
Single Supply
Voltage - Supply, Single/dual (±)
3 V ~ 3.6 V
Current - Supply
40mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
40-VFQFN, CSP Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD8195ACPZ-R7
Manufacturer:
MITSUBISHI
Quantity:
101
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
AVCC to AVEE
VTTI
VTTO
AMUXVCC
VREF_IN
VREF_OUT
Internal Power Dissipation
High Speed Input Voltage
High Speed Differential Input Voltage
Parallel Control Input Voltage
Storage Temperature Range
Operating Temperature Range
Junction Temperature
ESD, Human Body Model
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Input Pins Only
All Other Pins
5.5 V
5.5 V
Rating
3.7 V
AVCC + 0.6 V
AVCC + 0.6 V
5.5 V
1.81 W
AVCC − 1.4 V < V
AVCC + 0.6 V
2.0 V
AVEE − 0.3 V < V
AVCC + 0.6 V
−65°C to +125°C
−40°C to +85°C
150°C
±5 kV
±3 kV
IN
IN
<
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Rev. 0 | Page 5 of 20
THERMAL RESISTANCE
Table 5.
Package
40-Lead LFCSP_VQ
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8195 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition
temperature of the plastic, approximately 150°C. Temporarily
exceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of 175°C for an extended
period can result in device failure. To ensure proper operation,
it is necessary to observe the maximum power derating as
determined by the thermal resistance coefficients.
ESD CAUTION
θ
36
JA
θ
5.0
JC
AD8195
Unit
°C/W

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