AD8151ASTZ Analog Devices Inc, AD8151ASTZ Datasheet - Page 4

• Manufacturer Part Number: AD8151ASTZ
• Description: IC,Telecom Switching Circuit,QFP,184PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD8151ASTZ

• Function: Crosspoint Switch
• Circuit: 1 x 33:17
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±3 V ~ 5.25 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 184-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD8151
ABSOLUTE MAXIMUM RATINGS
T
Table 2.
Parameter
Supply Voltage
Internal Power Dissipation
Differential Input Voltage
Storage Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature, θ
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
A
V
V
V
V
V
V
184-Lead LQFP (ST-184)
= 25°C, unless otherwise noted.
DD
CC
DD
SS
SS
DD
− V
− V
− V
− V
− V
− V
CC
EE
EE
EE
SS
CC
JA
Rating
10.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
4.2 W
2.0 V
–65°C to +125°C
300°C
30°C/W
Rev. B | Page 4 of 40
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8151 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in
parametric performance due to a change in the stresses exerted
on the die by the package. Exceeding a junction temperature of
175°C for an extended period can result in device failure. To
ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figure 3.
6
5
4
3
2
1
–10
0
10
AMBIENT TEMPERATURE (°C)
20
30
Figure 3.
40
50
60
T
70
J
= 150°C
80
90