AD5532ABC-2 Analog Devices Inc, AD5532ABC-2 Datasheet - Page 19

• Manufacturer Part Number: AD5532ABC-2
• Description: IC,Sample/Track-and-Hold Amplifier,32-CHANNEL,CMOS,BGA,74PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD5532ABC-2

• Rohs Status: RoHS non-compliant
• Settling Time: 30µs
• Number Of Bits: 14
• Data Interface: Serial
• Number Of Converters: 34
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 623mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 74-CSPBGA
• Number Of Channels: 32
• Resolution: 14b
• Conversion Rate: 45KSPS
• Interface Type: PARALLEL/SERIAL 3W
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): ±9/5/±12/5/±15/5V
• Power Supply Requirement: Dual
• Output Type: Voltage
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): -4.75/8/4.75V
• Dual Supply Voltage (max): ±16.5/5.25V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 74
• For Use With: EVAL-AD5532HSEBZ - BOARD EVAL FOR AD5532HSEVAL-AD5532EBZ - BOARD EVAL FOR AD5532
• Lead Free Status / Rohs Status: Not Compliant

Typical Application Circuit (ISHA Mode)
The AD5532 can be used to set up voltage levels on 32 channels
as shown in the circuit that follows. An AD780 provides the 3 V
reference for the AD5532 and for the AD5541 16-bit DAC. A
simple 3-wire interface is used to write to the AD5541. Because
the AD5541 has an output resistance of 6.25 k Ω ( typ), the time
taken to charge/discharge the capacitance at the V
significant. Hence an AD820 is used to buffer the DAC output.
Note that it is important to minimize noise on V
when laying out the circuit.
POWER SUPPLY DECOUPLING
In any circuit where accuracy is important, careful
consideration of the power supply and ground return layout
helps to ensure the rated performance. The printed circuit
board on which the AD5532 is mounted should be designed so
that the analog and digital sections are separated and confined
to certain areas of the board. If the AD5532 is in a system where
multiple devices require an AGND-to-DGND connection, the
connection should be made at one point only. The star ground
point should be established as close as possible to the device.
For supplies with multiple pins (V
mended to tie those pins together. The AD5532 should have
ample supply bypassing of 10 μF in parallel with 0.1 μF on each
supply located as close to the package as possible, ideally right
up against the device. The 10 μF capacitors are the tantalum
bead type. The 0.1 μF capacitor should have low effective series
resistance (ESR) and effective series inductance (ESI), such as
the common ceramic types that provide a low impedance path
to ground at high frequencies, to handle transient currents due
to internal logic switching.
SCLK
DIN
CS
AV
CC
Figure 28. Typical Application Circuit (ISHA Mode)
AD780*
AD5541*
*ADDITIONAL PINS OMITTED FOR CLARITY
REF
V
OUT
AD820
V
DD
SS
, V
V
OFFS_IN
OFFS_OUT
REFIN
SCLK DIN
DD
AV
IN
AD5532*
, AV
CC
DV
CC
CC
) it is recom-
SYNC
IN
V
IN
SS
and REFIN
pin is
V
OUT
0–V
Rev. D | Page 19 of 20
OUT
31
The power supply lines of the AD5532 should use as large a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line. Fast switching
signals, such as clocks, should be shielded with digital ground
to avoid radiating noise to other parts of the board and should
never be run near the reference inputs. A ground line routed
between the D
them (not required on a multilayer board as there is a separate
ground plane, but separating the lines helps).
Note it is essential to minimize noise on V
Particularly for optimum ISHA performance, the V
be kept noise free. Depending on the noise performance of the
board, a noise filtering capacitor may be required on the V
line. If this capacitor is necessary, then for optimum throughput
it may be necessary to buffer the source which is driving V
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A micro-strip technique is by far the best, but not always
possible with a double-sided board. In this technique, the
component side of the board is dedicated to ground plane while
signal traces are placed on the solder side.
As is the case for all thin packages, care must be taken to avoid
flexing the package and to avoid a point load on the surface of
the package during the assembly process.
IN
and SCLK lines helps reduce crosstalk between
IN
and REFIN lines.
IN
AD5532
line must
IN
IN
.