5962-9553601QXA National Semiconductor, 5962-9553601QXA Datasheet - Page 4

VERY HI SPD, HI CURRENT OP AMP

5962-9553601QXA

Manufacturer Part Number
5962-9553601QXA
Description
VERY HI SPD, HI CURRENT OP AMP
Manufacturer
National Semiconductor
Type
Voltage Feedback Amplifierr
Datasheet

Specifications of 5962-9553601QXA

Rail/rail I/o Type
No
Number Of Elements
1
Unity Gain Bandwidth Product
170MHz
Slew Rate
2000V/us
Common Mode Rejection Ratio
80dB
Input Offset Voltage
1.5mV
Input Bias Current
10uA
Single Supply Voltage (typ)
9/12/15/18/24/28V
Dual Supply Voltage (typ)
±3/±5/±9/±12/±15V
Power Dissipation
730mW
Voltage Gain In Db
75dB
Power Supply Rejection Ratio
85dB
Power Supply Requirement
Single/Dual
Shut Down Feature
No
Single Supply Voltage (min)
5.5V
Single Supply Voltage (max)
36V
Dual Supply Voltage (min)
±2.75V
Dual Supply Voltage (max)
±18V
Technology
BiCOM
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
10
Package Type
CPAK
Number Of Channels
1
Voltage Gain Db
75 dB
Common Mode Rejection Ratio (min)
80 dB
Operating Supply Voltage
9 V, 12 V, 15 V, 18 V, 24 V, 28 V
Supply Current
8 mA at +/- 5 V
Maximum Power Dissipation
730 mW
Maximum Operating Temperature
+ 125 C
Package / Case
CPAK
Maximum Dual Supply Voltage
+/- 18 V
Minimum Operating Temperature
- 55 C
Lead Free Status / Rohs Status
Not Compliant
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Absolute Maximum Ratings
Supply Voltage (V
Differential Input Voltage
Maximum Power Dissipation
Output Short Circuit to Ground
Storage Temperature Range
Thermal Resistance
 θ
 θ
Package Weight (Typical)
Maximum Junction Temperature
ESD Tolerance
Recommended Operating Conditions
Supply Voltage
Operating Temperature Range
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
8LD Ceramic Dip
10LD Ceramic Flatpack
10LD Ceramic SOIC
JA
JC
8LD Ceramic Dip (Still Air)
8LD Ceramic Dip (500LF/Min Air flow)
10LD Ceramic Flatpack (Still Air)
10LD Ceramic Flatpack (500LF/Min Air flow)
10LD Ceramic SOIC (Still Air)
10LD Ceramic SOIC (500LF/Min Air flow)
8LD Ceramic Dip
10LD Ceramic Flatpack
10LD Ceramic SOIC
Subgroup
8A
8B
10
11
12
13
14
1
2
3
4
5
6
7
9
(Note
+
–V
(Note
4)
)
(Note
(Note
13)
(Note
(Note
10)
3)
(Note
2)
6)
2)
(Note
1)
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
Dynamic tests at
Dynamic tests at
Dynamic tests at
Settling time at
Settling time at
Settling time at
Static tests at
Static tests at
Static tests at
Description
4
(Note
1)
−65°C
−55°C
5.5V
Continuous
106°C/W
182°C/W
105°C/W
182°C/W
105°C/W
730mW
53°C/W
965mg
235mg
230mg
3°C/W
5°C/W
5°C/W
3000V
150°C
±10V
36V
T
T
V
A
A
S
+150°C
+125°C
36V
Temp °C
125
125
125
125
125
-55
-55
-55
-55
-55
25
25
25
25
25

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