5962-9553601QXA National Semiconductor, 5962-9553601QXA Datasheet - Page 19

• Manufacturer Part Number: 5962-9553601QXA
• Description: VERY HI SPD, HI CURRENT OP AMP
• Manufacturer: National Semiconductor
• Type: Voltage Feedback Amplifierr

Specifications of 5962-9553601QXA

• Rail/rail I/o Type: No
• Number Of Elements: 1
• Unity Gain Bandwidth Product: 170MHz
• Slew Rate: 2000V/us
• Common Mode Rejection Ratio: 80dB
• Input Offset Voltage: 1.5mV
• Input Bias Current: 10uA
• Single Supply Voltage (typ): 9/12/15/18/24/28V
• Dual Supply Voltage (typ): ±3/±5/±9/±12/±15V
• Power Dissipation: 730mW
• Voltage Gain In Db: 75dB
• Power Supply Rejection Ratio: 85dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 5.5V
• Single Supply Voltage (max): 36V
• Dual Supply Voltage (min): ±2.75V
• Dual Supply Voltage (max): ±18V
• Technology: BiCOM
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 10
• Package Type: CPAK
• Number Of Channels: 1
• Voltage Gain Db: 75 dB
• Common Mode Rejection Ratio (min): 80 dB
• Operating Supply Voltage: 9 V, 12 V, 15 V, 18 V, 24 V, 28 V
• Supply Current: 8 mA at +/- 5 V
• Maximum Power Dissipation: 730 mW
• Maximum Operating Temperature: + 125 C
• Package / Case: CPAK
• Maximum Dual Supply Voltage: +/- 18 V
• Minimum Operating Temperature: - 55 C
• Lead Free Status / Rohs Status: Not Compliant

Power Dissipation
The maximum power allowed to dissipate in a device is de-
fined as:
Where
θ
For example, for the LM7171 in a Ceramic SOIC package, the
maximum power dissipation at 25°C ambient temperature is
680 mW.
Thermal resistance, θ
size, package size and package material. The smaller the die
size and package, the higher θ
package has a lower thermal resistance (106°C/W) than that
of the Ceramic SOIC (182°C/W). Therefore, for higher dissi-
pation capability, use an 8-pin DIP package.
The total power dissipated in a device can be calculated as:
P
connected at the output. P
vice with a load connected at the output; it is not the power
dissipated by the load.
Furthermore,
For example, the total power dissipated by the LM7171 with
V
Q
S
PD
T
T
P
P
P
= ±15V and output voltage of 10V into 1 kΩ is
is the quiescent power dissipated in a device with no load
JA
J(max)
A
Q
L
D
: = output current × (voltage difference between sup-
: = supply current × total supply voltage with no load
FIGURE 6. The LM7171 Driving a 150 pF Load
= P
is the power dissipation in a device
is the maximum junction temperature
is the ambient temperature
is the thermal resistance of a particular package
ply voltage and output voltage of the same side of
supply voltage)
Q
+ P
with a 50Ω Isolation Resistor
L
P
D
JA
= (T
, depends on parameters such as die
P
D
L
J(max)
= P
is the power dissipated in the de-
Q
− T
JA
+ P
becomes. The 8-pin DIP
A
L
)/θ
JA
20159513
19
Application Circuit
= (6.5 mA) × (30V) + (10 mA) × (15V − 10V)
= 195 mW + 50 mW
= 245 mW
Fast Instrumentation Amplifier
Multivibrator
20159581
20159580
www.national.com
20159515
20159514