PZU5.1B2,115 NXP Semiconductors, PZU5.1B2,115 Datasheet - Page 8

• Manufacturer Part Number: PZU5.1B2,115
• Description: DIODE ZENER 5.1V 310MW SOD323F
• Manufacturer: NXP Semiconductors

Specifications of PZU5.1B2,115

• Package / Case: SC-90, SOD-323F
• Voltage - Zener (nom) (vz): 5.1V
• Voltage - Forward (vf) (max) @ If: 1.1V @ 100mA
• Current - Reverse Leakage @ Vr: 2µA @ 1.5V
• Tolerance: ±2%
• Power - Max: 310mW
• Impedance (max) (zzt): 60 Ohm
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 150°C
• Zener Voltage: 5.09 V
• Voltage Tolerance: 2 %
• Voltage Temperature Coefficient: 0.3 mV / K
• Power Dissipation: 550 mW
• Maximum Reverse Leakage Current: 2 uA
• Maximum Zener Impedance: 60 Ohms
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3920-2; 934059818115; PZU5.1B2 T/R

NXP Semiconductors
8. Package outline
9. Packing information
10. Soldering
PZUXB_SER_2
Product data sheet
Table 10.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package
PZU2.4B to
PZU36B
Fig 5.
Fig 6.
For further information and the availability of packing methods, see
Package outline SOD323F (SC-90)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD323F (SC-90)
1.65
Packing methods
SOD323F
0.95
Rev. 02 — 15 November 2009
Dimensions in mm
0.50
(2×)
2.7
2.3
Description
4 mm pitch, 8 mm tape and reel
1.8
1.6
3.05
2.80
2.10
1.60
1.35
1.15
1
2
Single Zener diodes in a SOD323F package
0.40
0.25
0.50
001aab169
0.60
0.5
0.3
Section
0.80
0.65
0.25
0.10
PZUxB series
[1]
Packing quantity
3000
-115
04-09-13
14.
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2009. All rights reserved.
10000
-135
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