PZU5.1B2,115 NXP Semiconductors, PZU5.1B2,115 Datasheet - Page 3

• Manufacturer Part Number: PZU5.1B2,115
• Description: DIODE ZENER 5.1V 310MW SOD323F
• Manufacturer: NXP Semiconductors

Specifications of PZU5.1B2,115

• Package / Case: SC-90, SOD-323F
• Voltage - Zener (nom) (vz): 5.1V
• Voltage - Forward (vf) (max) @ If: 1.1V @ 100mA
• Current - Reverse Leakage @ Vr: 2µA @ 1.5V
• Tolerance: ±2%
• Power - Max: 310mW
• Impedance (max) (zzt): 60 Ohm
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 150°C
• Zener Voltage: 5.09 V
• Voltage Tolerance: 2 %
• Voltage Temperature Coefficient: 0.3 mV / K
• Power Dissipation: 550 mW
• Maximum Reverse Leakage Current: 2 uA
• Maximum Zener Impedance: 60 Ohms
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-3920-2; 934059818115; PZU5.1B2 T/R

NXP Semiconductors
5. Limiting values
6. Thermal characteristics
7. Characteristics
PZUXB_SER_2
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 6.
[1]
[2]
[3]
Table 7.
T
[1]
Symbol
I
I
P
P
T
T
T
Symbol
R
R
Symbol
V
F
ZSM
j
j
amb
stg
ZSM
tot
F
th(j-a)
th(j-sp)
= 25
t
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm
Soldering point of cathode tab
Pulse test: t
p
= 100 μs; square wave; T
°
C unless otherwise specified
Parameter
forward current
non-repetitive peak reverse
current
non-repetitive peak reverse
power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
Limiting values
Thermal characteristics
Characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Parameter
forward voltage
p
≤ 300 μs; δ ≤ 0.02
Rev. 02 — 15 November 2009
j
= 25 °C prior to surge
Conditions
I
I
F
F
= 10 mA
= 100 mA
Conditions
T
Conditions
in free air
amb
≤ 25 °C
Single Zener diodes in a SOD323F package
[1]
[1]
[1]
[2]
[3]
Min
-
-
-
-
Min
-
-
-
-
−65
−65
[1]
[2]
[3]
PZUxB series
Min
-
-
-
Typ
-
-
Typ
-
-
-
Max
200
see
and
40
310
550
150
+150
+150
© NXP B.V. 2009. All rights reserved.
Max
0.9
1.1
Table 8
9
Max
400
230
55
2
2
Unit
V
V
.
.
Unit
K/W
K/W
K/W
Unit
mA
W
mW
mW
°C
°C
°C
3 of 12