HT1MO2S3E3M-T NXP Semiconductors, HT1MO2S3E3M-T Datasheet - Page 5
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
HT1MO2S3E3M-T
Manufacturer Part Number
HT1MO2S3E3M-T
Description
RFID Modules & Development Tools HITAG 1 MOA2 MODULE
Manufacturer
NXP Semiconductors
Datasheet
1.HT1MOA2S30E3118.pdf
(24 pages)
Specifications of HT1MO2S3E3M-T
Operating Current
30 mA
Operating Voltage
3.1 V to 4.2 V
Product
RFID Transponders
Wireless Frequency
125 KHz
Dimensions
7.55 mm x 11.75 mm x 0.45 mm
Operating Temperature Range
- 25 C to + 85 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
HT1MOA2S30/E/3,118
2.4 Storage Conditions
Temperature
Relative Humidity
Duration
2.5 Delivery Conditions
Delivery Identification
Types of Delivery
Packing and Transport
Bad Module Marking
Splicing Specifications
Labeling
Ht1moa3.doc/HS
Specifications of the HT1 MOA3 S30
15 - 30 °C
40 - 70 %
1 year
modules with the detail of good modules per reel, order number,
product type, no supplier identification on reels, bags and boxes.
Chip modules on reel
single chip modules (bulk goods)
According to documentation
"Packing Method Modules (reel)"
"Packing Method Modules (singulated)"
All bad modules (mechanical and
electrical faults) must be punched by
reject hole for customer
Bad positions (reel): <20%
Tape material: adhes. tape 15,5 +/- 0,7
mm, thermal resistance at
<190°C by < 100 cN tractive power and
< 30 sec. duration.
Identification label on the reel and on
carton bag:
- Product type
- Number of the reel
- Total number of positions
- Number of good positions
- Date of sealing (to be checked)
- Two batches per reel only
- Batchnumber indication (only coded,
Date of ready for shipment, reel numbers, total quantity of good
to be checked)
Page 5 of 24
Rev. 1.1
approx. 15.000 to 20.000
pcs. per reel,
tape width super 35 mm,
pitch 9,5 mm, 2 rows
500 pcs . per bag
Order-No. 3322 845 04881
see drawings chapter 3
see drawings chapter 3
1997-08-19