583616-5 TE Connectivity, 583616-5 Datasheet - Page 59

• Manufacturer Part Number: 583616-5
• Manufacturer: TE Connectivity
• Type: Bifurcated Contactr

Specifications of 583616-5

• Number Of Contacts: 1POS
• Number Of Contact Rows: Not Required
• Body Orientation: Straight
• Contact Plating: Gold Over Nickel
• Contact Material: Phosphor Bronze
• Termination Method: Crimp
• Mounting Style: Cable
• Operating Temp Range: -55C to 105C
• Pitch (mm): Not Requiredmm
• Housing Material: Not Required
• Housing Color: Not Required
• Current Rating (max): 5A
• Contact Resistance Max: 10
• Product Type: Contact
• Termination Method To Wire/cable: Crimp
• Wire Insulation Diameter (mm [in]): 0.89 – 1.40 [0.035 – 0.055]
• Color Code: Orange
• Contact Retention In Housing: Crimp Snap-In
• Solder Tail Contact Plating: Nickel (30)
• Centerline (mm [in]): 2.54 [0.100], 3.18 [0.125], 3.96 [0.156]
• Wire Range (mm [awg]): 0.08-0.24² [28-24]
• Contact Configuration: Bifurcated
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Base Material: Phosphor Bronze
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Contact Packaging Method: Loose Piece
• Lead Free Status / RoHS Status: Not Compliant

[8.51]
.335
Typ.
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Material and Finish:
Housing—Green, glass-filled
polyester
Contacts—Phosphor bronze, duplex
plated .000030 [0.00076] gold in con-
tact area; .000100 [0.00254] bright tin
on posts, with entire contact under-
plated .000030 [0.00076] nickel
Related Product Data:
Keying Plug—page 63
PC Board Hole Layouts—See below
PC Board Edge Pattern—page 63
Technical Documents:
(pages 186, 187):
Product Specification
108-9044
Instruction Sheet 408-7772
[7.49]
[4.19]
.295
.165
.200 [5.08] Row-to-Row Spacing
[3.25]
.128
Post Length
(See Chart)
Flow Solder Post
[3.18]
. 1 2 5
PC Board Hole Layout
Dia.
Recommended
R e f .
[5.08]
.200
B
[3.18]
.125
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
[1.32]
.052
Dia.
[2.54]
.100
Card Edge Connectors
(Solder Type, Board-to-Board)
Low Profile Connectors, .125 [3.18] Centerline
[5.08]
.200
[8.51]
.335
Typ.
[4.19]
[7.49]
.165
.295
.140 [3.56] Row-to-Row Spacing
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
#1 Cavity Identification
[3.25]
.128
[3.18]
PC Board Hole Layout
. 1 2 5
Post Length
(See Chart)
Flow Solder Post
Dia.
Recommended
[3.18]
.125
R e f .
PCBoard Thickness—
.055-.070 [1.40-1.78]
[3.18]
.125
B
Molded Characters (Upper and Lower Case
Letters Omitting Letters G, I, O &Q)
1
A
2
B
[3.56]
.140
[1.32]
.052
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
[3.18]
.125
[3.18]
C
.125
3
Dia.
B
D
[1.78]
A
E
.070
Typ.
Typ.
D
4
[3.56]
.140
5
E
F
6
[7.49]
[4.19]
.165
.295
2 (Plcs.)
[3.25]
.128
.235 [5.97] Row-to-Row Spacing
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
Dia.
[3.18]
. 1 2 5
[3.81]
Solder Eyelet Contact
.150
[7.11]
.280
[6.35]
.250
[7.62]
.300
R e f .
[11.68]
.460
Ref.
C
[5.97]
.235
Ref.
59