SFH 3600-2/3-Z OSRAM Opto Semiconductors Inc, SFH 3600-2/3-Z Datasheet - Page 7

• Manufacturer Part Number: SFH 3600-2/3-Z
• Description: Photodetector Transistors PHOTOTRANSISTOR
• Manufacturer: OSRAM Opto Semiconductors Inc
• Type: Chipr

Specifications of SFH 3600-2/3-Z

• Maximum Power Dissipation: 130 mW
• Maximum Dark Current: 50 nA
• Collector- Emitter Voltage Vceo Max: 35 V
• Fall Time: 30 us, 45 us
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Rise Time: 30 us, 45 us
• Package / Case: MIDLED
• Phototransistor Type: Phototransistor
• Number Of Elements: 1
• Emitter-collector Voltage (max): 7V
• Collector-emitter Voltage: 35V
• Collector Current (dc) (max): 15mA
• Collector-emitter Sat Volt (max): 0.15V
• Dark Current (max): 50nA
• Light Current: 200/320uA
• Power Dissipation: 130mW
• Peak Wavelength: 990nm
• Half-intensity Angle: 40deg
• Operating Temp Range: -40C to 100C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 2
• Package Type: MIDLED
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q65110A2665

Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
2007-04-03
A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
T
300
250
200
150
100
50
˚C
1
0
, may only be used in life-support devices or systems
0
255 ˚C
240 ˚C
217 ˚C
25 ˚C
Ramp Up
3 K/s (max)
50
120 s max
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
100
Recommended Solder Profile
Maximum Solder Profile
Minimum Solder Profile
7
150
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020C)
(acc. to J-STD-020C)
2
with the express written approval of OSRAM OS.
200
100 s max
30 s max
SFH 3600, SFH 3605
Ramp Down
6 K/s (max)
10 s min
t
250
260 ˚C
245 ˚C
235 ˚C
OHLA0687
s
+0 ˚C
-5 ˚C
+5 ˚C
-0 ˚C
±5 ˚C
300