HSDL-3020-021 Lite-On Electronics, HSDL-3020-021 Datasheet - Page 14

• Manufacturer Part Number: HSDL-3020-021
• Description: Infrared Transceivers IR Transceiver 4.0Mb/s
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3020-021

• Wavelength: 875 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 10 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 40 ns, 600 ns
• Maximum Fall Time: 40 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 190 mA
• Operating Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 10.4 mm x 2.95 mm x 2.5 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or
a 0.127 mm (0.005 inch) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. See Table 1, below the
drawing, for combin-ations of metal stencil aperture
and metal stencil thickness that should be used. Aper-
ture opening for shield pad is 3.05 mm x 1.1 mm as per
land pattern.
Table 1.
Stencil Thickness,
t (mm)
0.127 mm
0.11 mm
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keepout is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The mini-
mum solder resist strip width required to avoid solder
bridging adjacent pads is 0.2 mm. It is recommended
that two fiducial crosses be placed at mid length of the
pads for unit alignment.
Note: Wet/Liquid Photo-imageable solder resist/mask is recom-
mended.
14
h
SOLDER MASK
Aperture Size (mm)
Length, l
1.75 ± 0.05
2.4 ± 0.05
j
Width, w
0.55 ± 0.05
0.55 ± 0.05
Figure 3. Solder stencil aperture.
k
l
l
APERTURES AS PER
LAND DIMENSIONS
DIMENSION
h
l
k
j
mm
0.2
3.0
3.85
11.9
w
t