TFDU6103-TT3 Vishay, TFDU6103-TT3 Datasheet - Page 7

• Manufacturer Part Number: TFDU6103-TT3
• Description: Infrared Transceivers SIR 115.2kbits Top View
• Manufacturer: Vishay

Specifications of TFDU6103-TT3

• Data Rate Max: 4Mbps
• Data Transmission Distance: 1m
• Peak Wavelength: 886nm
• Supply Current: 2mA
• Supply Voltage Range: 2.4V To 5.5V
• Operating Temperature Range: -25°C To +85°C
• Msl: MSL 4 - 72 Hours
• Data Rate: 4Mbs (FIR)
• Idle Current, Typ @ 25° C: 2mA
• Link Range, Low Power: 1m
• Operating Temperature: -25°C ~ 85°C
• Orientation: Top View
• Shutdown: *
• Size: 9.7mm x 4.7mm x 4mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.4 V ~ 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

SETTING
MODE (2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic “high”.
2. Set TXD input to logic “low”. Wait t
3. Set SD to logic “low” (this negative edge latches state of
4. TXD must be held for t
After that TXD is enabled as normal TXD input and the
transceiver is set for the lower bandwidth (9.6 kbit/s to
115.2 kbit/s) mode.
Note
When applying this sequence to the device already in the lower
bandwidth mode, the SD pulse is interpreted as shutdown. In this
case the RXD output of the transceiver may react with a single pulse
(going active low) for a duration less than 2 µs. The operating
software should take care for this condition.
In case the applied SD pulse is longer than 4 µs, no RXD pulse is to
be expected but the receiver startup time is to be taken into account
before the device is in receive condition.
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU6103 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
Document Number: 81211
Rev. 1.4, 29-Jul-09
TABLE 2 - TRUTH TABLE
TXD, which determines speed setting).
Fig. 3 - Recommended Solder Profile for Sn/Pb soldering
High
Low
SD
19535
260
240
220
200
180
160
140
120
100
(3.0 - 4.0)
80
60
40
20
0
0
TO THE
Ag
2 to 4 °C/s
50
High > 150 µs
(0.5 - 0.9)
High
TXD
Low
Low
Low
100
x
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
[e-mail], [e-mail],
h
160 °C max.
Cu, there are two standard reflow
240 °C max.
120 to180 s
 200 ns.
150
Time/s
For technical questions within your region, please contact one of the following:
LOWER BANDWIDTH
INPUTS
2 to 4 °C/s
OPTICAL INPUT IRRADIANCE mW/m
200
s
for 2.4 V to 5.5 V Operation
 200 ns.
90 s max.
10 s max. at 230 °C
250
< max. irradiance E
> max. irradiance E
> min. irradiance E
300
< 4
x
x
x
350
e
e
e
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown in
figure 4 and 5 are Vishay's recommended profiles for use
with the TFDU6103 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However,
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application note,
describing manual soldering and desoldering.
2
SD
TXD
Weakly pulled (500 k) to V
[e-mail]
Fig. 2 - Mode Switching Timing Diagram
for
50 %
Low (active)
Low (active)
a
RXD
High
High
x
production
Vishay Semiconductors
t
s
OUTPUTS
50 %
t
h
CC1
process
50 %
TFDU6103
TRANSMITTER
High: FIR
Low: SIR
it
www.vishay.com
I
0
0
0
0
0
cannot
e
14873
be
7