HMMC-5620 Avago Technologies US Inc., HMMC-5620 Datasheet - Page 3

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HMMC-5620

Manufacturer Part Number
HMMC-5620
Description
TV / Video IC
Manufacturer
Avago Technologies US Inc.
Type
Gain Amplifierr
Datasheet

Specifications of HMMC-5620

Peak Reflow Compatible (260 C)
Yes
Bandwidth
20GHz
Leaded Process Compatible
Yes
Number Of Channels
1
Frequency (max)
20GHz
Output Power
12@20000MHzdBm
Power Supply Requirement
Single
Single Supply Voltage (max)
7.5V
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Supply Current
135@5VmA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HMMC-5620
Manufacturer:
TI/NSC
Quantity:
760
RF Input
Applications
The HMMC-5620 amplifier is de-
signed for use as a general pur-
pose wideband, high gain stage
in communication systems and
microwave instrumentation. It
is ideally suited for broadband
applications requiring high gain
and excellent port matches over
a 6 to 20 GHz frequency range.
Both RF input and output ports
are AC-coupled on chip.
Biasing and Operation
This amplifier is biased with a
single positive drain supply
Matching
GND
FEEDBACK
NTWK
GND
Matching
GND
(V
for the HMMC-5620 is V
5.0V, which results in I
mA (Typ.). No other bias sup-
plies or connections to the de-
vice are required for 6 to 20 GHz
operation. See Figure 3 for as-
sembly information.
Assembly Techniques
For RF bonds, Agilent recom-
mends low inductance mesh in-
terconnections for best return
loss performance.
GaAs MMICs are ESD sensitive.
ESD preventive measures must
FEEDBACK
DD
GND
NTWK
). The recommended bias
Schematic
Figure 1.
Matching
GND
DD
DD
FEEDBACK
NTWK
= 100
Drain Bias
=
GND
Matching
be employed in all aspects of
storage, handling, and assem-
bly.
MMIC ESD precautions, han-
dling considerations, die attach
and bonding methods are criti-
cal factors in successful GaAs
MMIC performance and reliabil-
ity.
Agilent application note #54,
"GaAs MMIC ESD, Die Attach
and Bonding Guidelines" pro-
vides basic information on these
subjects.
GND
GND
FEEDBACK
NTWK
Matching
RF Output
3

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