258 Wakefield Thermal Solutions, 258 Datasheet - Page 3

• Manufacturer Part Number: 258
• Description: Heat Sink
• Manufacturer: Wakefield Thermal Solutions
• Series: 258r

Specifications of 258

• Thermal Resistance: 12°C/W
• Width: 6.35mm
• Height: 9mm
• Heat Sink Material: Aluminum
• External Width: 6mm
• Length: 13mm
• Leaded Process Compatible: No
• Mounting Type: Adhesive
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 12.70mm x 6.35mm
• For Use With: Fused Glass Diodes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Package Cooled: -
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Thermal Resistance @ Natural: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: Q2012037

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
100
100
40
20
80
60
40
20
80
60
40
20
0
0
0
0
0
0
0
0
200
200
200
200
200
0.5
2
1
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
1.0
2
4
600
1.5
600
600
600
600
3
6
800
2.0
800
800
4
800
800
8
1000
1000
1000
2.5
5
1000
1000
10
10
5
0
20
18
16
14
12
10
8
6
4
2
0
10
8
6
4
2
0
100
80
60
40
20
100
40
20
0
0
80
60
40
20
0
0
0
0
0
0
200
200
200
0.5
200
200
1
2
HEA
HEA
HEA
A