247-195AB Wakefield Thermal Solutions, 247-195AB Datasheet

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247-195AB

Manufacturer Part Number
247-195AB
Description
Heat Sink
Manufacturer
Wakefield Thermal Solutions
Datasheet

Specifications of 247-195AB

Thermal Resistance
25°C/W
Heat Sink Material
Aluminum
Color
Black
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CT6
217-36CTT6
217-36CTR6
Material: Copper, Tin, Lead Plated
All other products, please contact factory for price, delivery, and minimums.
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
217-36CT6
Height Above
.390 (9.9)
.390 (9.9)
.390 (9.9)
PC Board
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
3. 250 Pieces per Reel.
217-36CTR6
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Tube
Bulk
30
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
Device + HS, 100 lfm
Device Power Dissipation. W
55°C @ 1W
55°C @ 1W
Convection
55°C @ 1W
Natural
Thermal Performance at Typical Load
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Forced
Device + HS, 300 lfm
Normally stocked

Related parts for 247-195AB

247-195AB Summary of contents

Page 1

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTR6 .390 ...

Page 2

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks MECHANICAL DIMENSIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 ...

Page 3

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 AND 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60AB-01 .600 (15.2) 233-60AB-05 .500 (12.7) 233-60AB-10 .725 (18.4) PATENT PENDING 236-150AB 1.500 (38.1) 236-150AB-01 ...

Page 4

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above Standard PC Board P/N in. (mm) 235-85AB .850 (21.6) 235-85AB-01 .850 (21.6) 235-85AB-05 .500 (12.7) 235-85AB-10 .975 (24.8) PATENT 5381041 Material: Aluminum, Black Anodized ...

Page 5

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 273-AB .375 (9.5) 273-AB-01 .375 (9.5) 273-AB-02 .375 (9.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS ...

Page 6

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 242-125AB-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 MECHANICAL DIMENSIONS 232 AND 238 SERIES Height Above Standard PC ...

Page 7

Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 244-145AB 1.450 (36.8) 244-145AB-50 1.650 (41.9) Material: Aluminum, ...

Page 8

... Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 (49.5) 247-195AB-50 1.950 (49.5) Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 248 SERIES Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks ...

Page 9

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N 288-1AB Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 ...

Page 10

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Height Above Standard PC Board P/N in. (mm) 270-AB 0.375 (9.4) 272-AB 0.375 (9.4) 280-AB 0.375 (9.4) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a ...

Page 11

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Height Above Standard PC Board P/N in. (mm) 250-122AB 1.220 (31.0) 250-122AB-09 1.220 (31.0) 250-122AB-25 1.380 (35.1) Material: Aluminum, Black ...

Page 12

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 286-AB 1.190 (30.2) 286-CBT 1.190 (30.2) 286-CT 1.190 (30.2) Efficient heat removal at low cost can be ...

Page 13

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 256 SERIES Thermal Retainers Height (Less Standard Mounting Tab) P/N in. (mm) 256-DM 0.190 (4.0) Cup Clips for TO-5 Case Style Semiconductors 260 SERIES Characteristics Thermal Resistance – Epoxy Insulated ...

Page 14

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 200 SERIES High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors Single-Level Star 201, 202,204,205, 211 Series Available Semiconductor Heat Sink Standard P/N Case Diameter Inside Dia. & Finish Min/Max Types in. (mm) in. ...

Page 15

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin 634-10ABP 634-15ABP 634-20ABP Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users ...

Page 16

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Page 17

... LFM 65° 5.5°C/W @ 200 LFM 55° 4.7°C/W @ 200 LFM 48° 4.2°C/M @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS TO-220, TO-247, TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection 41° 3.7°C/W @ 200 LFM 38° 3.3° ...

Page 18

... LFM 32° 2.9°C/W @ 200 LFM 25° 2.7°C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS TO-218, TO-220, TO-247 15-LEAD Multiwatt Thermal Performance at Typical Load Natural Convection 52° 3.1°C/W @ 200 LFM 46° 2.8°C/W @ 200 LFM 40° ...

Page 19

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above Standard P/N 690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized These low-cost heat sinks provide ...

Page 20

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Standard Dimensions P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, ...

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