ICK PGA 6 X 6 X 14 FISCHER ELEKTRONIK, ICK PGA 6 X 6 X 14 Datasheet
![HEAT SINK](/photos/23/70/237018/17t5902-30_sml.jpg)
ICK PGA 6 X 6 X 14
Manufacturer Part Number
ICK PGA 6 X 6 X 14
Description
HEAT SINK
Manufacturer
FISCHER ELEKTRONIK
Datasheet
1.ICK_PGA_6_X_6_X_14.pdf
(1 pages)
Specifications of ICK PGA 6 X 6 X 14
Packages Cooled
PGA
Thermal Resistance
18.6K/W
Width
14mm
Height
14mm
Length
14mm
Mounting Type
Thermally Conductive Adhesive / Foil
Body Plating
Black Anodized
For Use With
IC Design PGAs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Heatsinks for PGA /
14 x 14 x 14 mm, for IC design PGA and others
Parameters of article ICK PGA 6 x 6 x 14
Accessories/ related articles
Thermally conductive foil both sides adhesive / WLFT 404 14 x 14
Thermally conductive foil both sides adhesive / WLFT 405 14 x 14
R
dissipation loss [W]
mounting method
socket
suitable for processor type universal
width [mm]
heigth [mm]
plate thickness [mm]
length on stock [mm]
surface treatment
th
[K/W]
ICK PGA 6 x 6 x 14
18.6
6.4
therm. conductive foil / therm. cond. adhesive
universal
14
14
2.5
14
black anodised
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