ICK PGA 14 X 14 X 14 FISCHER ELEKTRONIK, ICK PGA 14 X 14 X 14 Datasheet
![HEAT SINK](/photos/23/70/237018/17t5902-30_sml.jpg)
ICK PGA 14 X 14 X 14
Manufacturer Part Number
ICK PGA 14 X 14 X 14
Description
HEAT SINK
Manufacturer
FISCHER ELEKTRONIK
Datasheet
1.ICK_PGA_14_X_14_X_14.pdf
(1 pages)
Specifications of ICK PGA 14 X 14 X 14
Packages Cooled
PGA
Thermal Resistance
9.6K/W
Width
35mm
Height
14mm
Length
35mm
Mounting Type
Thermally Conductive Adhesive / Foil
Body Plating
Black Anodized
For Use With
IC Design PGAs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Heatsinks for PGA /
35 x 35 x 14 mm, for IC design PGA and others
Parameters of article ICK PGA 14 x 14 x 14
Accessories/ related articles
Thermally conductive foil both sides adhesive / WLFT 404 35 x 35
Thermally conductive foil both sides adhesive / WLFT 405 35 x 35
R
dissipation loss [W]
mounting method
socket
suitable for processor type universal
width [mm]
heigth [mm]
plate thickness [mm]
length on stock [mm]
surface treatment
th
[K/W]
ICK PGA 14 x 14 x 14
9.6
12.5
therm. conductive foil / therm. cond. adhesive
universal
35
14
2.5
35
black anodised
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