ICK PGA 14 X 14 X 14 FISCHER ELEKTRONIK, ICK PGA 14 X 14 X 14 Datasheet

ICK PGA 14 X 14 X 14

Manufacturer Part Number

ICK PGA 14 X 14 X 14

Description

HEAT SINK

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_PGA_14_X_14_X_14.pdf (1 pages)

Specifications of ICK PGA 14 X 14 X 14

Packages Cooled

PGA

Thermal Resistance

9.6K/W

Width

35mm

Height

14mm

Length

35mm

Mounting Type

Thermally Conductive Adhesive / Foil

Body Plating

Black Anodized

For Use With

IC Design PGAs

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Heatsinks for PGA /

35 x 35 x 14 mm, for IC design PGA and others

Parameters of article ICK PGA 14 x 14 x 14

Accessories/ related articles

Thermally conductive foil both sides adhesive / WLFT 404 35 x 35

Thermally conductive foil both sides adhesive / WLFT 405 35 x 35

dissipation loss [W]

mounting method

socket

suitable for processor type universal

width [mm]

heigth [mm]

plate thickness [mm]

length on stock [mm]

surface treatment

[K/W]

ICK PGA 14 x 14 x 14

9.6

12.5

therm. conductive foil / therm. cond. adhesive

universal

2.5

black anodised

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