ICK PGA 17 X 17 X 12 FISCHER ELEKTRONIK, ICK PGA 17 X 17 X 12 Datasheet
ICK PGA 17 X 17 X 12
Manufacturer Part Number
ICK PGA 17 X 17 X 12
Description
HEAT SINK
Manufacturer
FISCHER ELEKTRONIK
Datasheet
1.ICK_PGA_17_X_17_X_12.pdf
(1 pages)
Specifications of ICK PGA 17 X 17 X 12
Packages Cooled
PGA
Thermal Resistance
9K/W
Width
43.6mm
Height
12mm
Length
43.6mm
Mounting Type
Thermally Conductive Adhesive / Foil
Body Plating
Black Anodized
For Use With
IC Design PGAs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Heatsinks for PGA /
43,6 x 43,6 x 12,3 mm, for IC design PGA and others
Parameters of article ICK PGA 17 x 17 x 12
Accessories/ related articles
Thermally conductive foil both sides adhesive / WLFT 404 43 x 43
Thermally conductive foil both sides adhesive / WLFT 405 43 x 43
R
dissipation loss [W]
mounting method
socket
suitable for processor type universal
width [mm]
heigth [mm]
plate thickness [mm]
length on stock [mm]
surface treatment
th
[K/W]
ICK PGA 17 x 17 x 12
9
6.5
therm. conductive foil / therm. cond. adhesive
universal
43.6
12.3
3.5
43.6
black anodised
Seite 1 von 1
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