VMMK-1218-BLKG Avago Technologies US Inc., VMMK-1218-BLKG Datasheet - Page 10

• Manufacturer Part Number: VMMK-1218-BLKG
• Description: TRANSISTOR,HEMT,N-CHAN,5V V(BR)DSS,WAFER
• Manufacturer: Avago Technologies US Inc.

Specifications of VMMK-1218-BLKG

• Package / Case: 0402 (1005 Metric) - 1.00mm L x 0.50mm W x 0.25mm H
• Current Rating: 100mA
• Power - Output: 12dBm
• Frequency: 10GHz
• Gain: 9dB
• Transistor Type: E-pHEMT
• Noise Figure: 0.81dB
• Current - Test: 20mA
• Voltage - Test: 3V
• Configuration: Single
• Gate-source Voltage (max): 1V
• Pin Count: 3
• Drain-gate Voltage (max): -5 to 1V
• Drain-source Volt (max): 5V
• Operating Temperature (max): 150C
• Mounting: Surface Mount
• Continuous Drain Current: 100mA
• Package Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Outline Drawing
Top and Side View
Bottom View
Notes:
1. • indicates pin 1
2. Dimensions are in millimeters
3. Pad Material is minimum 5.0 um thick Au
Suggested PCB Material and Land Pattern
Notes:
1. 0.010” Rogers RO4350
10
0.5mm
.022 [0.559]
0.2mm
0.3mm
.014 [0.356]
0.7mm
1.05mm
0.8mm
BYY
.008 [0.203]
.010 [0.254]
.005 [0.127]
.014 [0.356]
.020 [0.508]
Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
3. Recommended attachment is solder paste. Please
4. Apply solder paste using either a stencil printer or
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
Figure 15. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Part Number Ordering Information
Part Number
VMMK-1218-BLKG
VMMK-1218-TR1G
from topside if using a vacuum collet.
see Figure 8 for recommended solder reflow profile.
Conductive epoxy is not recommended.
soldering is not recommended.
dot placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will degrade
RF performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp to avoid damage
due to thermal shock.
temperature of 260ºC for 20 to 40 sec. Verify that the
profile will not expose device beyond these limits.
Allow the module to dry before testing.
300
250
200
150
100
50
0
0
Ramp 1 Preheat Ramp 2 Reflow
50
100
No. of Devices
100
5000
Peak = 250 ± 5 °C
SECONDS
150
Melting point = 218 °C
200
Container
antistatic bag
7” Reel
Cooling
250
300
Hand