CNY17F-3X001 Vishay, CNY17F-3X001 Datasheet - Page 15

Optocoupler

CNY17F-3X001

Manufacturer Part Number
CNY17F-3X001
Description
Optocoupler
Manufacturer
Vishay
Datasheets

Specifications of CNY17F-3X001

Leaded Process Compatible
Yes
Forward Current
60 mA
Maximum Input Diode Current
60 mA
Maximum Reverse Diode Voltage
6 V
Output Device
Transistor
Output Type
DC
Configuration
1
Input Type
DC
Maximum Collector Emitter Voltage
70 V
Maximum Collector Emitter Saturation Voltage
400 mV
Isolation Voltage
5300 Vrms
Current Transfer Ratio
200 %
Maximum Forward Diode Voltage
1.65 V
Maximum Collector Current
100 mA
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Package / Case
PDIP-6
No. Of Channels
1
Optocoupler Output Type
Phototransistor
Input Current
60mA
Output Voltage
70V
Opto Case Style
DIP
No. Of Pins
6
Approval Bodies
UL, IEC65, IEC950, BS6301,
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CNY17F-3X001
Quantity:
8 783
Notes
All voltages referred to are peak values except otherwise specified.
(1)
(2)
Testing input/output voltage requires all input pins and all output pins to be shorted
Option 1: Tested per DIN EN 60747-5-2 (VDE 0884)/DIN EN 60747-5-5 pending
Option 6: Wide lead spacing (10.16 mm creepage/clearance distances > 8 mm)
Option 7: Surface mount leads (creepage/clearance distances > 8 mm)
Option 8: Surface mount leads
Option 9: Surface mount leads
See CECC 00802, edition 1, for soldering conditions for SMT devices (option 7 and 9).
"-.." means dash selections
OPTION 6
DIP OPTOCOUPLERS WITH 0.4" (10.16 mm)
LEAD SPREAD
The leads of the optocouplers are bent according to a
spacing of 0.4" (10.16 mm). Dimensions deviating from the
standard type are:
Lead spacing
Creepage distance
Clearance
This version additionally complies with the following
standards:
• IEC 60950 DIN VDE 0805/05 90 (System 2 and 3 only)
Clearance-creepage distance = 8.0 min.
See standard version for pin configuration
OPTION 7
LEAD
OPTOCOUPLERS
These optocouplers are suitable for surface mounting.
Dimensions deviating from the standard type are:
Creepage distance > 8.0 mm
Clearance distance > 8.0 mm
This version additionally complies with the following
standards:
• IEC 60950 DIN VDE 0805/05 90 (system 2 and 3 only)
Document Number: 83713
Rev. 1.7, 11-Sep-07
Reinforced insulation up to an operating voltage of 400
V
Reinforced insulation up to an operating voltage of
400 V
See time-test voltage diagram
In preparation
RMS
or DC
RMS
BENDS
or DC
0.400 (10.16)
0.430 (10.92)
0.407 (10.36)
0.391 (9.96)
0.307 (7.8)
0.291 (7.4)
10.16 mm (0.4")
> 8.0 mm
> 8.0 mm
FOR
0.014 (0.35)
0.010 (0.25)
20°
SURFACE
For technical questions, contact: optocoupler.answers@vishay.com
17930
MOUNT
Option Information
During the soldering process, the package should not be
wetted with tin-lead solder to prevent the impairment of the
isolation features. Apart from iron soldering, only reflow
soldering methods (vapor phase, infrared and hot gas) are
permissible.
Permissible soldering conditions for SMD bending options:
please see reflow soldering profile
The soldering process may be repeated two times at the
most. Attention must be paid to the cooling down of the
device to 25 °C between the soldering processes.
Clearance and creepage distances must be considered for
the solder pad design.
Clearance-creepage distance = 8.0 min.
See standard version for pin configuration.
0.020 (0.51)
0.035 (0.90)
0.028 (0.7)
17931
MIN.
0.406 (10.3)
0.331 (8.41)
0.300 (7.62)
0.300 (7.62)
0.315 (8.0)
0.406 (10.3)
0.331 (8.4)
MIN.
TYP .
MAX.
MIN.
MIN.
MAX.
TYP .
Vishay Semiconductors
Option Information
0.150 (3.81)
0.130 (3.30)
0.180 (4.6)
0.160 (4.1)
0.015 (0.38)
0.020 (0.5)
typ.
DIP 6
DIP 4/8/16
0.05 (1.27) typ.
www.vishay.com
0.020 (0.5)
0.040 (1.02)
0.016 (0.4) typ.
0.031 (0.79)
typ.
5

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