SI5445BDC-T1-E3 Vishay, SI5445BDC-T1-E3 Datasheet - Page 2

• Manufacturer Part Number: SI5445BDC-T1-E3
• Description: TRANSISTOR,MOSFET,P-CHANNEL,8V V(BR)DSS,5.2A I(D),CHIP
• Manufacturer: Vishay
• Series: TrenchFET®r

Specifications of SI5445BDC-T1-E3

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 33 mOhm @ 5.2A, 4.5V
• Drain To Source Voltage (vdss): 8V
• Current - Continuous Drain (id) @ 25° C: 5.2A
• Vgs(th) (max) @ Id: 1V @ 250µA
• Gate Charge (qg) @ Vgs: 21nC @ 4.5V
• Power - Max: 1.3W
• Mounting Type: Surface Mount
• Package / Case: 1206-8 ChipFET™
• Minimum Operating Temperature: - 55 C
• Configuration: Single Hex Drain
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 0.033 Ohm @ 4.5 V
• Drain-source Breakdown Voltage: 8 V
• Gate-source Breakdown Voltage: +/- 8 V
• Continuous Drain Current: 5.2 A
• Power Dissipation: 1300 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SI5445BDC-T1-E3TR

Si5445BDC
Vishay Siliconix
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
www.vishay.com
2
SPECIFICATIONS T
Parameter
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
Reverse Recovery Charge
b
20
16
12
8
4
0
0.0
0.5
a
a
V
DS
Output Characteristics
a
- Drain-to-Source Voltage (V)
V
J
1.0
GS
= 25 °C, unless otherwise noted
= 5 thru 2.5 V
a
1.5
Symbol
R
V
I
t
t
I
I
D(on)
DS(on)
V
GS(th)
Q
Q
d(on)
d(off)
GSS
DSS
Q
g
Q
R
t
t
SD
t
2.0
rr
fs
gs
gd
r
f
g
g
rr
2.5
V
I
DS
1.5 V
V
D
1 V
2 V
DS
≅ - 1 A, V
= - 4 V, V
I
F
V
V
V
V
V
3.0
= - 8 V, V
V
= - 1.1 A, dI/dt = 100 A/µs
V
DS
V
GS
GS
GS
I
DS
V
S
DS
DS
DS
DD
= - 1.1 A, V
Test Conditions
≤ - 5 V, V
= - 4.5 V, I
= - 2.5 V, I
= - 1.8 V, I
= V
= - 5 V, I
= 0 V, V
= - 8 V, V
= - 4 V, R
GEN
GS
f = 1 MHz
GS
GS
, I
= - 4.5 V, I
= - 4.5 V, R
D
= 0 V, T
GS
GS
D
= - 250 µA
D
D
D
GS
GS
= - 5.2 A
L
= - 5.2 A
= - 4.5 A
= - 1.7 A
= ± 8 V
= - 4.5 V
= 4 Ω
= 0 V
= 0 V
J
D
= 85 °C
= - 5.2 A
g
20
16
12
= 6 Ω
8
4
0
0.0
0.5
- 0.45
V
Min.
- 20
Transfer Characteristics
GS
- Gate-to-Source Voltage (V)
1.0
0.027
0.035
0.050
Typ.
- 0.8
1.8
3.3
18
14
12
22
75
50
75
40
8
S-83054-Rev. B, 29-Dec-08
Document Number: 73251
T
1.5
C
25 °C
= - 55 °C
± 100
0.033
0.043
0.060
Max.
- 1.0
- 1.2
115
115
- 1
- 5
21
20
35
75
60
2.0
125 °C
Unit
nA
µA
nC
nC
ns
Ω
Ω
V
A
S
V
2.5