MMBZ15VDL NXP Semiconductors, MMBZ15VDL Datasheet - Page 5

no-image

MMBZ15VDL

Manufacturer Part Number
MMBZ15VDL
Description
DIODE,DUAL TVS,UNI DIR,40W,12V,SOT23
Manufacturer
NXP Semiconductors
Datasheet

Specifications of MMBZ15VDL

Reverse Stand-off Voltage Vrwm
12.8V
Breakdown Voltage Range
14.3V To 15.8V
Clamping Voltage Vc Max
21.2V
Diode Configuration
Common Cathode
Peak Pulse Current Ippm
1.9A
Diode Case
RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBZ15VDL
Manufacturer:
NXP
Quantity:
36 000
Part Number:
MMBZ15VDL
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
MMBZ15VDL
0
Company:
Part Number:
MMBZ15VDL-7-01-F
Quantity:
105 000
Part Number:
MMBZ15VDL-7-F
Manufacturer:
DIODES
Quantity:
9 000
Company:
Part Number:
MMBZ15VDL-7-F
Quantity:
105 000
Part Number:
MMBZ15VDLT1
Manufacturer:
DIODES
Quantity:
2 419
Part Number:
MMBZ15VDLT1
Manufacturer:
ON
Quantity:
1 891
Part Number:
MMBZ15VDLT1
Manufacturer:
ON Semiconductor
Quantity:
3
Part Number:
MMBZ15VDLT1
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MMBZ15VDLT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MMBZ15VDLT1G
0
Company:
Part Number:
MMBZ15VDLT1G
Quantity:
33 000
NXP Semiconductors
6. Thermal characteristics
MMBZXVCL_MMBZXVDL_SER_1
Product data sheet
Fig 1.
(%)
I
PP
150
100
50
0
0
10/1000 s pulse waveform according to
IEC 61643-321
100 % I
1.0
PP
Table 8.
Table 9.
[1]
[2]
[3]
Standard
Per diode
IEC 61000-4-2; level 4 (ESD)
MIL-STD-883; class 3 (human body model)
Symbol
Per device
R
R
; 10 s
50 % I
th(j-a)
th(j-sp)
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering point at pin 3.
2.0
PP
; 1000 s
Parameter
thermal resistance from junction
to ambient
thermal resistance from junction
to solder point
ESD standards compliance
Thermal characteristics
3.0
Double ESD protection diodes for transient overvoltage suppression
t
006aab319
p
(ms)
Rev. 01 — 3 September 2008
MMBZxVCL; MMBZxVDL series
4.0
Fig 2.
100 %
10 %
Conditions
in free air
90 %
ESD pulse waveform according to
IEC 61000-4-2
I
PP
Conditions
> 15 kV (air); > 8 kV (contact)
> 8 kV
t
r
30 ns
0.7 ns to 1 ns
60 ns
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
© NXP B.V. 2008. All rights reserved.
001aaa631
Max
350
280
60
t
2
.
Unit
K/W
K/W
K/W
5 of 15

Related parts for MMBZ15VDL