B72482S9999X2 EPCOS Inc, B72482S9999X2 Datasheet - Page 21

• Manufacturer Part Number: B72482S9999X2
• Description: LAB KIT, SHCV, MOTOR
• Manufacturer: EPCOS Inc

Specifications of B72482S9999X2

• Rohs Compliant: YES
• Svhc: No SVHC (20-Jun-2011)
• Features: 9 Automotive Series (SR1K20M105X, SR1K20M155X, SR1K20M225X, SR2K20M474X, SR2S14BM475X, SR6K35M474X, SR6K35M474X, SR6K20M105X, SR6K20M105X)

Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
7
7.1
7.2
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Leaded transient voltage/RFI suppressors (SHCVs)
SHCV series
According to JEDEC J-STD-020D. Please refer to chapter 2.
Notes for proper soldering
Preheating and cooling
Repair / rework
Cleaning
Solder paste printing (reflow soldering)
Page 21 of 29
As mounted on substrate