B72482S9999X2 EPCOS Inc, B72482S9999X2 Datasheet - Page 14

Manufacturer Part Number

B72482S9999X2

Description

LAB KIT, SHCV, MOTOR

Manufacturer

EPCOS Inc

Datasheet

1.B72482S9999X2.pdf (29 pages)

Rohs Compliant

YES

Svhc

No SVHC (20-Jun-2011)

Features

9 Automotive Series (SR1K20M105X, SR1K20M155X, SR1K20M225X, SR2K20M474X, SR2S14BM475X, SR6K35M474X, SR6K35M474X, SR6K20M105X, SR6K20M105X)

Soldering directions

1.1

The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base met-

allization layer. This allows great flexibility in the selection of soldering parameters. The tin pre-

vents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel bar-

rier termination is suitable for all commonly-used soldering methods.

Multilayer CTVS: Structure of nickel barrier termination

1.2

Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips in-

tended for conductive adhesion. This metallization improves the resistance of large chips to ther-

mal shock.

In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corro-

sion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid appli-

cations as well. The silver-palladium termination is not approved for lead-free soldering.

Multilayer varistor: Structure of silver-palladium termination

Please read Cautions and warnings and

Important notes at the end of this document.

Leaded transient voltage/RFI suppressors (SHCVs)

SHCV series

Terminations

Nickel barrier termination

Silver-palladium termination

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