XF2M-1415-1A-R100 Omron, XF2M-1415-1A-R100 Datasheet - Page 17

• Manufacturer Part Number: XF2M-1415-1A-R100
• Description: CONNECTOR FPC 14POS 0.5MM SMD
• Manufacturer: Omron
• Series: XF2Mr
• Type: FPC Connectorr

Specifications of XF2M-1415-1A-R100

• Connector Type: Top and Bottom Contacts
• Number Of Positions: 14
• Pitch: 0.020" (0.50mm)
• Ffc, Fcb Thickness: 0.30mm
• Height Above Board: 0.083" (2.10mm)
• Mounting Type: Surface Mount, Right Angle
• Cable End Type: Straight
• Termination: Solder
• Locking Feature: Rotary Lock, Backlock
• Contact Finish: Gold
• Contact Finish Thickness: 5.9µin (0.15µm)
• Operating Temperature: -30°C ~ 85°C
• Current Rating: 0.500A
• Voltage Rating: 50V
• Housing Material: Liquid Crystal Polymer (LCP)
• Contact Gender: SKT
• Mounting Style: Surface Mount
• Number Of Contact Rows: 1
• Number Of Contacts: 14POS
• Pitch (mm): 0.5mm
• Body Orientation: Right Angle
• Contact Resistance Max: 50mOhm
• Voltage Rating Max: 50VDC/50VAC
• Operating Temp Range: -30C to 85C
• Current Rating (max): 0.5A
• Housing Color: Natural
• Contact Material: Copper Alloy
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Product Height (mm): 2mm
• Product Depth (mm): 5.9mm
• Product Length (mm): 11.1mm
• Mounting Angle: Straight
• Termination Style: Solder Pin
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: XF2M14151AR100

Greater Freedom in Board Design with a Bottom
Wall and the Smallest On-board Area in the Industry
• Smallest on-board area and volume in the industry.
• Low on-board profile of only 1.2 mm.
• Highest board design surface efficiency in the industry with
• Construction with secure slider locking mechanism.
• Applicable FPC thickness of 0.3 mm.
■ Ratings and Specifications
XF2L-@@@5-1A
■ Dimensions
Table of Dimensions
Upper-contact Models
XF2L-@@@5-1@
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
note 2.)
ZIF Slide-locking Connector
(0.5-mm Pitch)
RoHS Compliant
a bottom wall preventing terminal exposure.
Pins
(See
1.05
10
12
13
18
21
26
30
4
6
7
8
9
1
XF2L- @@25-1 (Upper-contact Models)
XF2L- @@35-1 (Lower-contact Models)
(See note 1.)
XF2L-0425-1@
XF2L-0625-1@
XF2L-0725-1@
XF2L-0825-1@
XF2L-0925-1@
XF2L-1025-1@
XF2L-1225-1@
XF2L-1325-1@
XF2L-1825-1@
XF2L-2125-1@ 10.0 14.4 15.4 11.1 14.38 15.38 13.78 15.78
XF2L-2625-1@ 12.5 16.9 17.9 13.6 16.88 17.88 16.28 18.28
XF2L-3025-1@ 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
Model
0.5
0.5 A AC/DC
50 V AC/DC
30 m Ω max.
(at 20 mV DC max., 100 mA max.)
250V AC for 1 min.
(leakage current: 1 mA max.)
20 times
− 30 to 85 ° C
(with no icing or condensation)
D
B
A
C
D
A
1.5
2.5
3.0
3.5
4.0
4.5
5.5
6.0 10.4 11.4
8.5 12.9 13.9
0.2
B
5.9
6.9
7.4
7.9
8.4
8.9
9.9 10.9
C
6.9
7.9
8.4
8.9
9.4
9.9
D
2.6
3.6
4.1
4.6
5.1
5.6
6.6
7.1 10.38 11.38
9.6 12.88 13.88 12.28 14.28
5.88
6.88
7.38
7.88
8.38
8.88
9.88 10.88
0.75
E
2.5 min.
0.35
0.5
6.88
7.88
8.38
8.88
9.38
9.88
Applicable FPC Dimensions
F
3.05
±0.1
±0.03
3.05
3.45
3.45
5.28
6.28
6.78
7.28
7.78
8.28 10.28
9.28 11.28
9.78 11.78
G
(D−0.1)
1.2
1.2
0.5
A
7.28
8.28
8.78
9.28
9.78
H
±0.05
±0.05
±0.05
With slider open
With slider open
■ Materials and Finish
XF2L-@@@5-1A
Lower-contact Models
Reinforcement board
Ordering
Housing
Slider
Contacts
Hold-down Spring copper alloy/fused-tin plating (1.5 μ m)
1.35 (Effective
interface length)
T=0.3±0.03
(Conductive plating)
note 2.)
4.55
4.55
Pins
(See
10
12
13
15
18
19
20
22
24
30
(See note.)
5
6
7
8
Model
(5)
(See note 1.)
XF2L-0535-1@
XF2L-0635-1@
XF2L-0735-1@
XF2L-0835-1@
XF2L-1035-1@
XF2L-1235-1@
XF2L-1335-1@
XF2L-1535-1@
XF2L-1835-1@
XF2L-1935-1@
XF2L-2035-1@
XF2L-2235-1@ 10.5 14.9 15.9 11.6 14.88 15.88 14.28 16.28
XF2L-2435-1@ 11.5 15.9 16.9 12.6 15.88 16.88 15.28 17.28
XF2L-3035-1@ 14.5 18.9 19.9 15.6 18.88 19.88 18.28 20.28
0.55
LCP resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
Model
1.34
(Upper-contact Models)
±0.1
±0.1
1
±0.1
Note. Use polyimide and thermoset adhesive for
XF2L
PCB Mating Dimensions (Top View)
A
2.0
2.5
3.0
3.5
4.5
5.5
6.0 10.4 11.4
7.0 11.4 12.4
8.5 12.9 13.9
9.0 13.4 14.4 10.1 13.38 14.38 12.78 14.78
9.5 13.9 14.9 10.6 13.88 14.88 13.28 15.28
reinforcement film material.
B
6.4
6.9
7.4
7.9
8.9
9.9 10.9
0.5
C
7.4
7.9
8.4
8.9
9.9
±0.05
A
G
H
D
3.1
3.6
4.1
4.6
5.6
6.6
7.1 10.38 11.38
8.1 11.38 12.38 10.78 12.78
9.6 12.88 13.88 12.28 14.28
LCP resin (UL94V-0)/
brown
±0.05
F
E
±0.1
±0.1
XF2L
(Lower-contact Models)
0.25
6.38
6.88
7.38
7.88
8.88
9.88 10.88
+0.05
E
0
XF2L
7.38
7.88
8.38
8.88
9.88
F
5.78
6.28
6.78
7.28
8.28 10.28
9.28 11.28
9.78 11.78
G
7.78
8.28
8.78
9.28
H
17