C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 3

• Manufacturer Part Number: C1608X7R1C103K
• Description: CAP CER 10000PF 16V X7R 10% 0603
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C1608X7R1C103K

• Voltage - Rated: 16V
• Capacitance: 10000pF
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.037" (0.95mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6855-2

TDK Multilayer Ceramic Chip Capacitors
Application Manual
Storage
TDK multilayer ceramic chip capacitors will not lose their electrical
characteristics in ambient conditions. However, solderability and taping
properties may change during extended storage. Therefore, the following
precautionary measures are recommended.
Storage environment
The packaging of chip capacitors is designed to have a long shelf life, but
in order to minimize the aging of the packaging materials, storage conditions
should be at less than 40°C and under 70% relative humidity. Use TDK
multilayer ceramic chip capacitors within six months of receiving.
Atmosphere
Chlorine gas or sulfuric acid in the air may adversely affect the solderability
of the termination, therefore, avoid exposure to this environment.
Rapid temperature changes.
When removing TDK multilayer ceramic chip capacitors from their storage
place,l make sure that they are not subjected to any differences in
temperature that would cause moisture condensation.
Surface mount technology
Solder pad design
The solder filet volume will directly affect the strength of the chip capacitor.
1) The larger the amount of solder used on TDK multilayer ceramic chip
2) Avoid using common solder land for multiple terminations and provide
Foot print size and solder amount
Component span
44
capacitors, the greater the stress on the capacitors which results in a
weakened condition. Solder land dimensions shall be designed to
ensure that appropriate solder amounts are used.
individual solder land for each termination.
Solder resist
a : Solder quantity is appropriate
b : Solder resist is too far away from the chip termination allowing
too much soldering space.
Solder
a
Solder land
Solder
b
Solder land
Solder resist
Distance between adjacent terminations
Land width
Example of recommend land shape and dimensions
1) Land dimensions
Recommend land pattern for reflow use
Type
C1005
C1608
C2012
C3216
C3225
C4532
C5750
Since there are differences between the appropriate solder volume,
depending on the soldering method selected, we recommend the land
shape and dimensions shown below.
a : Solder quantity is appropriate
b : Excessive solder when lands are too wide.
Solder
Solder resist
a : Solder quantity is appropriate
b : Chip capacitor is too close the adjacent chip capacitor
Solder resist
A
Solder
A
0.3 to 0.5
0.6 to 0.8
0.9 to 1.2
2 to 2.4
2 to 2.4
3.1 to 3.7
4.1 to 4.8
a
a
Solder land
Solder land
B
B
0.35 to 0.45
0.6 to 0.8
0.7 to 0.9
1 to 1.2
1 to 1.2
1.2 to 1.4
1.2 to 1.4
b
b
Solder land
Solder land
C
0.4 to 0.6
0.6 to 0.8
0.9 to 1.2
1.1 to 1.6
1.9 to 2.5
2.4 to 3.2
4.0 to 5.0
Solder resist
Solder
(in millimeters)
Solder