C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 9

• Manufacturer Part Number: C1608X7R1C103K
• Description: CAP CER 10000PF 16V X7R 10% 0603
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C1608X7R1C103K

• Voltage - Rated: 16V
• Capacitance: 10000pF
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.037" (0.95mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6855-2

TDK Multilayer Ceramic Chip Capacitors
Application Manual
Flow soldering
The flow soldering method involves first temporarily gluing the TDK
multilayer ceramic chip capacitors with adhesives in the appropriate
positions on the printed circuit board, then coats it with flux and dips it into
a preheated molten solder bath.
The TDK multilayer ceramic chip capacitors tested with solder at 230 to
250°C so that adequate measures must be taken to prevent thermal cracks.
Caution: If TDK multilayer ceramic chip capacitors are used that exceed
the range of delivery specifications given or specifications in the catalog,
cracks may occur within the chips and that presents a danger of reduced
reliability. Rapid temperature changes and local heating during soldering
are also causes of cracks. Please refer to the soldering methods below
for optimum soldering benefits. (temperature profile)
Recommended flow soldering temperature conditions
Recommended temperatures for flow soldering
Cautions when setting preheat temperatures
When setting preheat temperatures, we recommend as preheat conditions
high temperatures which can pass the following points for test circuit
boards
1) Check points when preheat temperature is too low
2) Check points when preheat temperature is too high
Cautions in spray soldering
In the flow method, a pump is constantly spraying molten solder so that if
there is a fluctuation in the quantity of solder supplied over unit time, there
is a danger of unsoldered locations or bridges occurring. There is a of
soldering defects caused by flux gas. To avoid this danger, pay attention
to the following points when selecting the spray equipment and setting
the spray height .
50
300
250
200
a:Flux flows too easily
b:Possibility of thermal cracks
a: Flux deteriorates and reoxidizes even when oxide film is removed.
b: Too large a warp in circuit board
c: Loss of reliability in chips and other parts
0
(especially at temperatures of 160°C and above)
60seconds or more
Soldering method
C3216 and under
Pre-heating
T
2 to 3seconds
Soldering
Change in temperature(˚C)
60seconds or more
T = < 150
Cooling
1) Height of spraying in the single wave method (distance from spray
Setting spray height h in the single wave method
2) Depth of dip in single wave method
Setting of dip depth t in the single wave method
Examples of conditions to avoid: When dip depth t is too high.
h:Height of flow
Molten solder
nozzle to solder surface)
a: When the h value in the diagram below increases (that is there is a
b: when the h value is low, the surface pressure on the circuit board is
Recommend value: we recommend an h value of 5mm or less.
a: If the t value in the diagram below is too large, the rate of occurrence
b: If the t value is too low, there rate of occurrence of unsolder sections
Recommended t value: Recommend an appropriate t value of 0.5 to 1 mm.
nozzle
Molten solder
large flow in unit time and the flow speed is fast), the surface pressure
on the circuit board is governed by force in the horizontal direction
and the flatness of the solder surface is impaired, and that increases
the rate of occurrence of solder defects.
governed by force in the vertical direction and the flow of solder is
uniformly maintained.
of bridges increases.
increases.
Molten solder
t:Depth of dip
Excess quantity of solder
Appropriate quantity of solder