C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 7

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C1608X7R1C103K

Manufacturer Part Number
C1608X7R1C103K
Description
CAP CER 10000PF 16V X7R 10% 0603
Manufacturer
TDK Corporation
Series
Cr
Datasheet

Specifications of C1608X7R1C103K

Voltage - Rated
16V
Capacitance
10000pF
Tolerance
±10%
Temperature Coefficient
X7R
Mounting Type
Surface Mount, MLCC
Operating Temperature
-55°C ~ 125°C
Features
Low ESR
Applications
General Purpose
Package / Case
0603 (1608 Metric)
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Thickness
0.037" (0.95mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Ratings
-
Lead Spacing
-
Other names
445-6855-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C1608X7R1C103K
Manufacturer:
TDK
Quantity:
146 432
TDK Multilayer Ceramic Chip Capacitors
Application Manual
Reflow soldering
The reflow soldering method places the components on dispensed solder
amounts on the printed circuit board. The chips are then attached by using
heat to melt the solder. The method of heating for melting the solder may
be the overall heating method or the local heating method.
Reflow method
With this method, adhesives usually are used to temporarily hold the TDK
MLC chip capacitors in place. This prevents skewing and tombstoning
effects. Also if there is a rapid temperature curve in heat treatment, there
is a danger of thermal cracks appearing in all of the chips, so we recommend
the soldering conditions shown below (temperature profile).
Skewing
Before soldering
After soldering
48
Overall heating method
Local heating method
Infrared
Hot plate
VPS
Air heating
Laser
Light beam
Recommended soldering profile for reflow method
If there is a rapid increase in heat on the molten solder temperature,
tombstoning effects may be more common. If there is a rapid temperature
change during the soldering operation, thermal cracks may be more
common.
Generally recommended temperature conditions for reflow soldering
300
250
230
200
0
Soldering method
C3216 and under
60sec. or more
C3225 and over
T
Pre-heating
Change in temperature(˚C)
1 to 20sec.
Soldering
T = < 190
T = < 130
Cooling(natural cooling)

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