PIC18LF4682-I/ML Microchip Technology, PIC18LF4682-I/ML Datasheet - Page 358
![80KB Flash, 3KB RAM, ECAN, 1024 EEPROM 44 QFN 8x8x0.9mm TUBE](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC18LF4682-I/ML
Manufacturer Part Number
PIC18LF4682-I/ML
Description
80KB Flash, 3KB RAM, ECAN, 1024 EEPROM 44 QFN 8x8x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PCM18XT0.pdf
(484 pages)
2.PIC18F2221-ISO.pdf
(46 pages)
3.PIC18F2682-ISP.pdf
(6 pages)
4.PIC18F2682-ISP.pdf
(4 pages)
Specifications of PIC18LF4682-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
80KB (40K x 16)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.25K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.25 KB
Interface Type
EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
44
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PCM18XT0 PDF datasheet
- PIC18F2221-ISO PDF datasheet #2
- PIC18F2682-ISP PDF datasheet #3
- PIC18F2682-ISP PDF datasheet #4
- Current page: 358 of 484
- Download datasheet (9Mb)
PIC18F2682/2685/4682/4685
24.4
The Fail-Safe Clock Monitor (FSCM) allows the
microcontroller to continue operation in the event of an
external oscillator failure by automatically switching the
device clock to the internal oscillator block. The FSCM
function
Configuration bit.
When FSCM is enabled, the INTRC oscillator runs at
all times to monitor clocks to peripherals and provide a
backup clock in the event of a clock failure. Clock
monitoring (shown in Figure 24-3) is accomplished by
creating a sample clock signal, which is the INTRC out-
put divided by 64. This allows ample time between
FSCM sample clocks for a peripheral clock edge to
occur. The peripheral device clock and the sample
clock are presented as inputs to the Clock Monitor latch
(CM). The CM is set on the falling edge of the device
clock source, but cleared on the rising edge of the
sample clock.
FIGURE 24-3:
Clock failure is tested for on the falling edge of the
sample clock. If a sample clock falling edge occurs
while CM is still set, a clock failure has been detected
(Figure 24-4). This causes the following:
• the FSCM generates an oscillator fail interrupt by
• the device clock source is switched to the internal
• the WDT is reset.
During switchover, the postscaler frequency from the
internal oscillator block may not be sufficiently stable for
timing sensitive applications. In these cases, it may be
desirable to select another clock configuration and enter
an alternate power-managed mode. This can be done to
attempt a partial recovery or execute a controlled shut-
down. See Section 3.1.4 “Multiple Sleep Commands”
and Section 24.3.1 “Special Considerations for
Using Two-Speed Start-up” for more details.
DS39761C-page 358
setting bit, OSCFIF (PIR2<7>);
oscillator block (OSCCON is not updated to show
the current clock source – this is the fail-safe
condition); and
Peripheral
Source
(32 μs)
INTRC
Clock
Fail-Safe Clock Monitor
is
(2.048 ms)
enabled
488 Hz
÷ 64
FSCM BLOCK DIAGRAM
by
(edge-triggered)
Clock Monitor
Latch (CM)
C
S
setting
Q
Q
the
Detected
Failure
Clock
FCMEN
To use a higher clock speed on wake-up, the INTOSC
or postscaler clock sources can be selected to provide
a higher clock speed by setting bits, IRCF2:IRCF0,
immediately after Reset. For wake-ups from Sleep, the
INTOSC or postscaler clock sources can be selected
by setting the IRCF2:IRCF0 bits prior to entering Sleep
mode.
The FSCM will detect failures of the primary or second-
ary clock sources only. If the internal oscillator block
fails, no failure would be detected, nor would any action
be possible.
24.4.1
Both the FSCM and the WDT are clocked by the
INTRC oscillator. Since the WDT operates with a
separate divider and counter, disabling the WDT has
no effect on the operation of the INTRC oscillator when
the FSCM is enabled.
As already noted, the clock source is switched to the
INTOSC clock when a clock failure is detected.
Depending on the frequency selected by the
IRCF2:IRCF0 bits, this may mean a substantial change
in the speed of code execution. If the WDT is enabled
with a small prescale value, a decrease in clock speed
allows a WDT time-out to occur and a subsequent
device Reset. For this reason, fail-safe clock events
also reset the WDT and postscaler, allowing it to start
timing from when execution speed was changed and
decreasing the likelihood of an erroneous time-out.
24.4.2
The fail-safe condition is terminated by either a device
Reset or by entering a power-managed mode. On
Reset, the controller starts the primary clock source
specified in Configuration Register 1H (with any
required start-up delays that are required for the
oscillator mode, such as OST or PLL timer). The
INTOSC multiplexer provides the device clock until the
primary clock source becomes ready (similar to a Two-
Speed Start-up). The clock source is then switched to
the primary clock (indicated by the OSTS bit in the
OSCCON register becoming set). The Fail-Safe Clock
Monitor then resumes monitoring the peripheral clock.
The primary clock source may never become ready
during start-up. In this case, operation is clocked by the
INTOSC multiplexer. The OSCCON register will remain
in its Reset state until a power-managed mode is
entered.
FSCM AND THE WATCHDOG TIMER
EXITING FAIL-SAFE OPERATION
© 2009 Microchip Technology Inc.
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