PIC16F72-E/SP Microchip Technology, PIC16F72-E/SP Datasheet - Page 123

• Manufacturer Part Number: PIC16F72-E/SP
• Description: 28 PIN, 3.5KB STD FLASH, 128 RAM, 22 I/O,
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F72-E/SP

• Rohs Compliant: YES
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 5 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

© 2007 Microchip Technology Inc.
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
A1
EXPOSED
E
A
NOTE 1
PAD
Units
A1
A3
E2
D2
D
N
A
E
K
e
b
L
E2
2
1
MIN
0.80
0.00
3.65
3.65
0.23
0.50
0.20
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
MAX
1.00
0.05
0.70
4.20
4.20
0.35
PIC16F72
–
L
DS39597C-page 121
b
K
e