MCP1403-E/MF Microchip Technology, MCP1403-E/MF Datasheet - Page 9

• Manufacturer Part Number: MCP1403-E/MF
• Description: IC,Dual MOSFET Driver,CMOS,LLCC,8PIN,PLASTIC
• Manufacturer: Microchip Technology
• Type: Low Sider

Specifications of MCP1403-E/MF

• Configuration: Low-Side
• Input Type: Inverting
• Delay Time: 40ns
• Current - Peak: 4.5A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-DFN
• Rise Time: 28 ns
• Fall Time: 28 ns
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
V
has a voltage range of 4.5V to 18V. This input must be
decoupled to ground with a local capacitor. This bypass
capacitor provides a localized low-impedance path for
the peak currents that are to be provided to the load.
3.2
The MOSFET driver input is a high-impedance, TTL/
CMOS-compatible input. The input also has hysteresis
between the high and low input levels, allowing them to
be driven from slow rising and falling signals, and to
provide noise immunity.
3.3
Ground is the device return pin. The ground pin should
have a low impedance connection to the bias supply
source return. High peak currents will flow out the
ground pin when the capacitive load is being
discharged.
© 2007 Microchip Technology Inc.
Note 1:
DD
8-Pin
SOIC
PDIP
—
—
—
—
—
—
—
—
—
is the bias supply input for the MOSFET driver and
1
2
3
4
5
6
7
8
PIN DESCRIPTIONS
Supply Input (V
Control Inputs A and B
Ground (GND)
Duplicate pins must be connected for proper operation.
8-Pin
DFN
PAD
—
—
—
—
—
—
—
—
1
2
3
4
5
6
7
8
PIN FUNCTION TABLE
16-Pin
SOIC
10
12
13
14
15
16
11
—
1
2
3
4
5
6
7
8
9
DD
)
Symbol
OUT B
OUT B
OUT A
OUT A
GND
GND
IN A
IN B
V
V
NC
NC
NC
NC
NC
NC
NC
DD
DD
Table
(1)
No Connection
Control Input for Output A
No Connection
Ground
Ground
No Connection
Control Input for Output B
No Connection
No Connection
Output B
Output B
Supply Input
Supply Input
Output A
Output A
No Connection
Exposed Metal Pad
3-1.
3.4
Outputs A and B are CMOS push-pull output that is
capable of sourcing and sinking 4.5A of peak current
(V
gate of the external MOSFET will stay in the intended
state even during large transients. These output also
has a reverse current latch-up rating of 1.5A.
3.5
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
DD
= 18V). The low output impedance ensures the
Outputs A and B
Exposed Metal Pad
Description
MCP1403/4/5
DS22022B-page 9