MCP1403-E/MF Microchip Technology, MCP1403-E/MF Datasheet

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MCP1403-E/MF

Manufacturer Part Number
MCP1403-E/MF
Description
IC,Dual MOSFET Driver,CMOS,LLCC,8PIN,PLASTIC
Manufacturer
Microchip Technology
Type
Low Sider
Datasheet

Specifications of MCP1403-E/MF

Configuration
Low-Side
Input Type
Inverting
Delay Time
40ns
Current - Peak
4.5A
Number Of Configurations
2
Number Of Outputs
2
Voltage - Supply
4.5 V ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-DFN
Rise Time
28 ns
Fall Time
28 ns
Supply Voltage (min)
4.5 V
Supply Current
2 mA
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Number Of Drivers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Features
• High Peak Output Current: 4.5A (typ.)
• Low Shoot-Through/Cross-Conduction Current in
• Wide Input Supply Voltage Operating Range:
• High Capacitive Load Drive Capability:
• Short Delay Times: 40 ns (typ.)
• Low Supply Current:
• Latch-Up Protected: Will Withstand 1.5A Reverse
• Logic Input Will Withstand Negative Swing
• Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN,
Applications
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
• Motor and Solenoid Drive
Package Types
© 2007 Microchip Technology Inc.
GND
Output Stage
- 4.5V to 18V
- 2200 pF in 15 ns
- 5600 pF in 34 ns
- With Logic ‘1’ Input – 1.0 mA (typ.)
- With Logic ‘0’ Input – 150 µA (typ.)
Current
Up To 5V
and 16-Pin SOIC
GND
IN A
IN B
IN A
IN B
NC
NC
1
2
3
4
PDIP/SOIC
1
2
3
4
8-Pin DFN
8-Pin
4.5A Dual High-Speed Power MOSFET Drivers
8
7
6
5
(2)
MCP1403
8
7
6
5
NC
OUT A
V
OUT B
DD
MCP1403
NC
OUT A
V
OUT B
DD
MCP1404
NC
OUT A
V
OUT B
DD
MCP1404
NC
OUT A
V
OUT B
DD
MCP1405
NC
OUT A
V
OUT B
DD
MCP1405
NC
OUT A
V
OUT B
DD
Note 1: Duplicate pins must both be connected for
GND
GND
IN A
IN B
NC
NC
NC
NC
MCP1403/4/5
General Description
The MCP1403/4/5 are a family of dual-inverting, dual-
non-inverting, or complimentary output drivers. They
can delivery high peak currents of 4.5A typically into
capacitive loads. These devices also feature low shoot-
through
propagation delays.
The MCP1403/4/5 drivers operate from a 4.5V to 18V
single power supply and can easily charge and
discharge 2200 pF gate capacitance in under 15 ns
(typ). They provide low enough impedances in both the
on and off states to ensure the MOSFETs intended
state will not be affected, even by large transients. The
input to the MCP1403/4/5 may be driven directly from
either TTL or CMOS (3V to 18V).
The MCP1403/4/5 dual-output 4.5A driver family is
offered in both surface-mount and pin-through-hole
packages with a -40
The low thermal resistance of the thermally enhanced
DFN package allows for greater power dissipation
capability for driving heavier capacitive or resistive
loads.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin. All
terminals are fully protect against Electrostatic
Discharge (ESD) up to 4 kV.
2: Exposed pad of the DFN package is electrically
1
2
3
4
5
6
7
8
16-Pin SOIC
proper operation.
isolated.
current,
16
15
14
13
12
11
10
9
o
matched
C to +125
MCP1403
NC
OUT A
OUT A
V
V
OUT B
OUT B
NC
DD
DD
MCP1404
o
rise/fall
C temperature rating.
NC
OUT A
OUT A
V
V
OUT B
OUT B
NC
DD
DD
DS22022B-page 1
MCP1405
times
NC
OUT A
OUT A
V
V
OUT B
OUT B
NC
DD
DD
and

Related parts for MCP1403-E/MF

MCP1403-E/MF Summary of contents

Page 1

... They provide low enough impedances in both the on and off states to ensure the MOSFETs intended state will not be affected, even by large transients. The input to the MCP1403/4/5 may be driven directly from either TTL or CMOS (3V to 18V). The MCP1403/4/5 dual-output 4.5A driver family is ...

Page 2

... MCP1403/4/5 (1) Functional Block Diagram Input Effective Input (Each Input) GND Note 1: Unused inputs should be grounded. DS22022B-page 2 Inverting 730 µA 300 mV Non-inverting 4.7V MCP1403 Dual Inverting MCP1404 Dual Non-inverting MCP1405 Inverting / Non-inverting V DD Output © 2007 Microchip Technology Inc. ...

Page 3

... A — — — — 4.5 — 18.0 V — 1.0 2.0 mA — 0.15 0.25 mA MCP1403/4/5 ≤ 18V. DD Conditions 0V ≤ V ≤ Test DC Test mA 18V OUT mA 18V OUT DD = 18V (Note Duty cycle ≤ 2%, t ≤ 300 µsec. Figure 4-1, Figure 4 2200 pF L Figure ...

Page 4

... MCP1403/4/5 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V ≤ V Parameters Sym Input Logic ‘1’, High Input Voltage V IH Logic ‘0’, Low Input Voltage V IL Input Current I IN Output High Output Voltage ...

Page 5

... FIGURE 2-4: Voltage. 100 12V 1000 10000 FIGURE 2-5: Load. 160 135 110 FIGURE 2-6: Amplitude. MCP1403/4/5 6800 pF 4700 pF 2200 pF 1800 Supply Voltage (V) Fall Time vs. Supply 12V 5V 18V 10000 Capacitive Load (pF) Fall Time vs. Capacitive V = 12V 1800 pF LOAD Input Amplitude (V) Propagation Delay vs ...

Page 6

... FIGURE 2-10: Temperature FIGURE 2-11: High) vs. Supply Voltage + Both Inputs = FIGURE 2-12: Low) vs. Temperature. Both Inputs = 110 125 o Temperature ( C) Quiescent Current vs (MCP1404 (MCP1403 +150 + Supply Voltage (V) Output Resistance (Output (MCP1404 (MCP1403 +150 Supply Voltage (V) Output Resistance (Output © 2007 Microchip Technology Inc. ...

Page 7

... FIGURE 2-17: Frequency. 140 120 2 MHz 100 80 1 MHz 10000 10 FIGURE 2-18: Frequency. MCP1403/4/5 6,800 pF 4,700 pF 2,200 pF 100 pF 100 1000 Frequency (kHz) Supply Current vs. 4,700 pF 6,800 pF 2,200 pF 100 pF 100 1000 10000 Frequency (kHz) Supply Current vs. 6,800 pF 4,700 pF 2,200 pF 100 pF 100 ...

Page 8

... MCP1403/4/5 Typical Performance Curves (Continued) = +25°C with 4.5V ≤ V Note: Unless otherwise indicated 1.00E- 1.00E- 1.00E- 1.00E- Supply Voltage (V) Note: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a sin- gle driver, divide the stated value by 2. ...

Page 9

... Exposed Metal Pad The exposed metal pad of the DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package. MCP1403/4/5 DS22022B-page 9 ...

Page 10

... MOSFETs or IGBTs. In high frequency switching power supplies, the PWM controller may not have the drive capability to directly drive the power MOSFET. A MOSFET driver like the MCP1403/4/5 family can be used to provide additional source/sink capability ...

Page 11

... Placing a ground plane beneath the MCP1403/4/5 will help as a radiated noise shield as well as providing some heat sinking for power dissipated within the device. 4.5 Power Dissipation The total internal power dissipation in a MOSFET driver is the summation of three separate power dissipation elements. ...

Page 12

... In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS22022B-page 12 : Example MCP1403 E/MF 0648 256 Example: MCP1403 E/P^^256 e 3 0648 Example: MCP1405E SN^^0648 e 3 256 Example: MCP1405 ...

Page 13

... A3 0.20 REF D 4.92 BSC D1 4.67 BSC D2 3.85 4.00 E 5.99 BSC E1 5.74 BSC E2 2.16 2.31 b 0.35 0.40 L 0.50 0.60 K 0.20 – φ – – Microchip Technology Drawing C04-113B MCP1403/4 NOTE 1 MAX 1.00 0.80 0.05 4.15 2.46 0.47 0.75 – 12° DS22022B-page 13 ...

Page 14

... MCP1403/4/5 8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width ...

Page 15

... A – A2 1. 0.25 L 0.40 L1 φ 0° c 0.17 b 0.31 α 5° β 5° MCP1403/4/5 α c β NOM MAX 8 1.27 BSC – 1.75 – – – 0.25 6.00 BSC 3.90 BSC 4.90 BSC – 0.50 – 1.27 1.04 REF – 8° – ...

Page 16

... MCP1403/4/5 16-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width ...

Page 17

... Page 14: Updated Package Outline Drawing • Page 15: Updated Package Outline Drawing • Page 16: Updated Package Outline Drawing • Page 17: Updated Revision History • Page 19: Corrected Package Codes in Product Identification System Revision A (December 2006) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP1403/4/5 DS22022B-page 17 ...

Page 18

... MCP1403/4/5 NOTES: DS22022B-page 18 © 2007 Microchip Technology Inc. ...

Page 19

... MCP1403-E/SN: 4.5A Dual Inverting MOSFET Driver, 8LD SOIC package. b) MCP1403-E/P: 4.5A Dual Inverting MOSFET Driver, 8LD PDIP package . c) MCP1403-E/MF: 4.5A Dual Inverting MOSFET Driver, 8LD DFN package . d) MCP1403-E/SO: 4.5A Dual Inverting MOSFET Driver, 16LD SOIC package. a) MCP1404T-E/SN: Tape and Reel. 4.5A Dual Non-Inverting, ...

Page 20

... MCP1403/4/5 NOTES: DS22022B-page 20 © 2007 Microchip Technology Inc. ...

Page 21

... PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 22

... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...

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