DSPIC30F4011T-30I/PT Microchip Technology, DSPIC30F4011T-30I/PT Datasheet - Page 224
![IC,DSP,16-BIT,CMOS,TQFP,44PIN,PLASTIC](/photos/6/82/68251/c04-076_pt_sml.jpg)
DSPIC30F4011T-30I/PT
Manufacturer Part Number
DSPIC30F4011T-30I/PT
Description
IC,DSP,16-BIT,CMOS,TQFP,44PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F4012-30ISO.pdf
(238 pages)
2.DSPIC30F4012-30ISO.pdf
(18 pages)
3.DSPIC30F4012-30ISO.pdf
(6 pages)
4.DSPIC30F4012-30ISO.pdf
(16 pages)
5.DSPIC30F4012-30ISO.pdf
(22 pages)
Specifications of DSPIC30F4011T-30I/PT
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
48KB (16K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
AC30F006 - MODULE SKT FOR DSPIC30F 44TQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
DSPIC30F4011T30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4011T-30I/PT
Manufacturer:
ST
Quantity:
2 001
Company:
Part Number:
DSPIC30F4011T-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F4012-30ISO PDF datasheet
- DSPIC30F4012-30ISO PDF datasheet #2
- DSPIC30F4012-30ISO PDF datasheet #3
- DSPIC30F4012-30ISO PDF datasheet #4
- DSPIC30F4012-30ISO PDF datasheet #5
- Current page: 224 of 238
- Download datasheet (4Mb)
dsPIC30F4011/4012
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70135G-page 224
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
PAD
E2
1
2
MIN
0.80
0.00
6.30
6.30
0.25
0.30
0.20
N
MILLIMETERS
0.65 BSC
0.20 REF
8.00 BSC
8.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
–
D2
© 2010 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
–
K
e
b
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