DSPIC30F3010-20E/SO Microchip Technology, DSPIC30F3010-20E/SO Datasheet - Page 39

• Manufacturer Part Number: DSPIC30F3010-20E/SO
• Description: IC,DSP,16-BIT,CMOS,SOP,28PIN,PLASTIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3010-20E/SO

• Rohs Compliant: YES
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-SOIC (7.5mm Width)
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TABLE 11-4:
© 2010 Microchip Technology Inc.
0000
0000
0000
0000
Step 11: Initiate the erase cycle.
0000
0000
0000
—
0000
0000
0000
0000
0000
Note 1:
Command
(Binary)
Steps 2-8 are only required for the dsPIC30F5011/5013 devices. These steps may be skipped for all other
devices in the dsPIC30F family.
200558
883B38
200AA9
883B39
A8E761
000000
000000
—
000000
000000
A9E761
000000
000000
(Hexadecimal)
SERIAL INSTRUCTION EXECUTION FOR BULK ERASING PROGRAM MEMORY
(ONLY IN NORMAL-VOLTAGE SYSTEMS) (CONTINUED)
Data
MOV
MOV
MOV
MOV
BSET NVMCON, #WR
NOP
NOP
Externally time ‘P13a’ ms (see
Timing
NOP
NOP
BCLR NVMCON, #WR
NOP
NOP
Requirements”)
#0x55, W8
W8, NVMKEY
#0xAA, W9
W9, NVMKEY
Description
Section 13.0 “AC/DC Characteristics and
DS70102K-page 39