GS1559CBE2 GENNUM, GS1559CBE2 Datasheet - Page 20

IC, DES, 48.5MHZ 20BIT 1.485GBPS BGA-100

GS1559CBE2

Manufacturer Part Number
GS1559CBE2
Description
IC, DES, 48.5MHZ 20BIT 1.485GBPS BGA-100
Manufacturer
GENNUM
Datasheet

Specifications of GS1559CBE2

Supply Voltage Range
1.71V To 1.89V, 3.13V To 3.47V
Operating Temperature Range
0°C To +70°C
Digital Ic Case Style
BGA
No. Of Pins
100
Termination Type
SMD
Control Interface
Serial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
2.4 Solder Reflow Profiles
The GS1559 is available in a Pb or Pb-free package. It is recommended that the
Pb package be soldered with Pb paste using the Standard Eutectic profile shown
in
reflow profile shown in
NOTE: It is possible to solder a Pb-free package with Pb paste using a Standard
Eutectic profile with a reflow temperature maintained at 245
Figure 2-1: Standard Eutectic Solder Reflow Profile (Pb package, Pb paste)
Temperature
260˚C
250˚C
217˚C
200˚C
150˚C
Figure 2-2: Maximum Pb-free Solder Reflow Profile (Pb-free package, Pb-free
paste)
30572 - 7
Temperature
230˚C
220˚C
183˚C
150˚C
100˚C
25˚C
25˚C
Figure
2-1, and the Pb-free package be soldered with Pb-free paste using the
May 2007
Figure
2-2.
120 sec. max
60-180 sec. max
8 min. max
6 min. max
3˚C/sec max
3˚C/sec max
60-150 sec.
60-150 sec.
10-20 sec.
20-40 sec.
GS1559 Data Sheet
o
C – 250
o
C.
6˚C/sec max
6˚C/sec max
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Time
Time

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