S29JL032H90TFI320 Spansion Inc., S29JL032H90TFI320 Datasheet - Page 12

• Manufacturer Part Number: S29JL032H90TFI320
• Description: IC, FLASH, 32MBIT, 90NS, TSOP-48
• Manufacturer: Spansion Inc.

Specifications of S29JL032H90TFI320

• Memory Type: Flash
• Memory Size: 32Mbit
• Memory Configuration: 4M X 8 / 2M X 16
• Ic Interface Type: CFI, Parallel
• Access Time: 90ns
• Supply Voltage Range: 2.7 To 3.6 V
• Memory Case Style: TSOP
• Data Bus Width: 8 bit, 16 bit
• Architecture: Boot Sector
• Interface Type: Conventional
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 2 mA
• Mounting Style: SMD/SMT
• Operating Temperature: + 85 C
• Package / Case: TSOP-48
• Rohs Compliant: YES
• No. Of Pins: 48
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

7.
12
Ordering Information
The order number (Valid Combination) is formed by the following:
Note
1. Type 0 is standard. Specify others as required; TSOPs can be packed in Types 0 and 3.
2. Operating voltage V
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
Spansion sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29JL032H
Device Family
S29JL032H
Device Family
S29JL032H
3.0 Volt-only, 32 Megabit (2 M x 16-Bit/4 M x 8-Bit) Simultaneous Read/Write Flash Memory
Manufactured on 130 nm process technology
60
CC
Speed Option
T
varies depending on speed option.
(Note 2)
60
70
90
A
I
00
Package, Material, Set and
0
S29JL032H
Temperature Range
S29JL032H Valid Combinations
Packing Type
0 = Tray
3 = 13-inch Tape and Reel
Model Number
01 = Top Boot Device, 4 Banks: 4/12/12/4 Mb
02 = Bottom Boot Device, 4 Banks: 4/12/12/4 Mb
21 = Top Boot Device, 2 Banks: 4/28 Mb
22 = Bottom Boot Device, 2 Banks: 4/28 Mb
31 = Top Boot Device, 2 Banks: 8/24 Mb
32 = Bottom Boot Device, 2 Banks: 8/24 Mb
41 = Top Boot Device, 2 Banks: 16/16 Mb
42 = Bottom Boot Device, 2 Banks: 16/16 Mb
Temperature Range
I
Package Material Set
A = Standard
F = Pb-free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
Speed Option
60 = 60 ns
70 = 70 ns
90 = 90 ns
D a t a
= Industrial (–40°C to +85°C)
TAI
TFI
S h e e t
Number
Model
01
02
21
22
31
32
41
42
S29JL032H_00_B8 August 31, 2009
Packing Type
(Note 1)
0
3
TS048
Package Type
TSOP