TB6608FNG Toshiba, TB6608FNG Datasheet - Page 29

• Manufacturer Part Number: TB6608FNG
• Description: STEPPER MOTOR DRIVE, 13V 0.8A SSOP20
• Manufacturer: Toshiba

Specifications of TB6608FNG

• No. Of Outputs: 2
• Output Current: 600mA
• Output Voltage: 15V
• Supply Voltage Range: 2.7V To 5.5V, 2.5V To 13.5V
• Driver Case Style: SSOP
• No. Of Pins: 20
• Operating Temperature Range: -20°C To +85°C
• Motor Type: Stepper
• Rohs Compliant: Yes
• Function: Driver
• Vopmax (vm*): 13.5V (15V)
• Io (lpeak): 0.6A (0.8A)
• Excitation: 1/8 step
• I/f: CLK input
• Mixed Decay Mode: no
• Package: SSOP24
• Rohs Compatible†: yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Points to Remember on Handling of ICs
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(2)
(3)
Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (T
time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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TB6608FNG
2007-12-17
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