LIS3LV02DQ STMicroelectronics, LIS3LV02DQ Datasheet - Page 16

• Manufacturer Part Number: LIS3LV02DQ
• Description: ACCELEROMETER TRPL AXIS 28QFPN
• Manufacturer: STMicroelectronics

Specifications of LIS3LV02DQ

• Axis: X, Y, Z
• Acceleration Range: ±2g, 6g
• Sensitivity: 1024LSB/g, 340LSB/g
• Voltage - Supply: 2.16 V ~ 3.6 V
• Output Type: Digital
• Bandwidth: 40Hz ~ 2.56kHz Selectable
• Interface: I²C, SPI
• Mounting Type: Surface Mount
• Package / Case: 28-QFN
• Sensing Axis: X, Y, Z
• Acceleration: 2 g, 6 g
• Digital Output - Number Of Bits: 12 bit, 16 bit
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.16 V
• Supply Current: 0.6 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Digital Output - Bus Interface: I2C, SPI
• Body Style: QFPN
• Function: Accelerometer
• Primary Type: Accelerometer
• Range, Measurement: 2/6 g
• Voltage, Supply: 3.6 V
• No. Of Axes: 3
• Ic Interface Type: I2C, SPI
• Sensor Case Style: QFN
• No. Of Pins: 28
• Supply Voltage Range: 2.16V To 3.6V
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: Yes
• For Use With: 497-6249 - BOARD EVAL ACCEL DGTL LIS3LV02DQ497-5069 - EVAL BOARD 3AXIS MEMS ACCELLRMTR
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4919

4 Application Hints
4
4.1
16/42
Application Hints
Figure 3.
The device core is supplied through Vdd line while the I/O pads are supplied through Vdd_IO
line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Al) should be placed as near
as possible to the pin 3 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper behavior
of the IC (refer to Fig. 3). It is possible to remove Vdd mantaining Vdd_IO without blocking the
communication busses.
The functionality of the device and the measured acceleration data is selectable and accessible
through the I
floating. Refer to application note AN2041 for further information on device usage.
Soldering Information
The QFN-28 package is lead free and green package qualified for soldering heat resistance
according to JEDEC J-STD-020C. Central die pad and pin #1 indicator are physically
connected to GND. Land pattern and soldering recommendations are available upon request.
Vdd
LIS3LV02DQ Electrical Connection
2
C/SPI interface.When using the I
GND
10uF
100nF
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
1
7
28
8
LIS3LV02DQ
(TOP VIEW)
CD00047926
22
14
2
C, CS must be tied high while SDO must be left
21
15
Vdd_IO
DIRECTION OF THE
DETECTABLE
ACCELERATIONS
Z
1
LIS3LV02DQ
Y
X