RDK-249 Power Integrations, RDK-249 Datasheet - Page 13

• Manufacturer Part Number: RDK-249
• Description: KIT REF DESIGN PFS762HG
• Manufacturer: Power Integrations
• Series: HiperTFS®r

Specifications of RDK-249

• Main Purpose: Reference Design, PC Power Supply
• Embedded: No
• Utilized Ic / Part: TFS762HG
• Primary Attributes: 12V 25A, 5V 2.9A Outputs, 300 ~ 385 VDC Input
• Output Voltage: 5 V
• Input / Supply Voltage (max): 385 VDC
• Input / Supply Voltage (min): 300 VDC
• Duty Cycle (max): 50 %
• Mounting Style: Through Hole
• Output Current: 2.9 A
• Output Power: 14.5 W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Secondary Attributes: -
• Other names: 596-1398

2. Second a 15 mA threshold (I
Note: unlike the TinySwitch-III the HiperTFS BYPASS pin capacitor
does not provide any programming capability. Instead the
recommended BYPASS pin capacitor should always be a 1 mF
(ceramic) capacitor.
Main and Standby Line Overvoltage Detection (OV)
The overvoltage threshold is included in the device, and can be
used to disable the device during overvoltage (with the use of
an additional external signal Zener). The overvoltage threshold
is set sufficiently high to prevent accidental triggering during
boost PFC overshoot conditions. When the overvoltage
condition is triggered, it will simultaneously shutdown both the
Main and Standby. The overvoltage feature is intended for use
with external components (circuitry), to program the overvoltage
threshold independently of the undervoltage thresholds (see the
Applications section for details).
High-Power eSIP Package
The HiperTFS package is designed to minimize the physical size
of the device, while maintaining a low thermal impedance and
sufficient electrical spacing for the pins. The package has 12
functional pins with 4 pins removed for increased pin-to-pin
spacing between high-voltage pins. The low-side two-switch
forward and flyback MOSFETs have a thermal impedance of
less than 1 °C/W to the exposed pad on the back of the
package. Since this pad is referenced to the SOURCE pin
(Source), it is at electrical ground potential and thus can be
connected to the heat sink without need for electrical insulation.
The high-side MOSFET is over-molded to achieve electrical
isolation and thus also allows direct connection to the heat sink.
www.powerint.com
latch-off. When the BYPASS pin current exceeds this
threshold, the standby and main converters are latched-off.
This latch can be reset by pulling the LINE-SENSE pin below
the line undervoltage threshold (I
the BYPASS pin below 4.7 V.
BP(SD)
L(SB-UVOFF)
)for standby secondary OVP
), or by discharging
Output Power Table
Table 5.
TFS757HG
TFS758HG
TFS759HG
TFS760HG
TFS761HG
TFS762HG
TFS763HG
TFS764HG
Notes:
1. Maximum practical continuous power in an open frame design with adequate
2. Package: eSIP16/12. (Note: Direct attach to heat sink, does not require
heat sinking (assuming heat sink θ
ambient temperature (see Key Applications Considerations for more information).
insulation SIL pad)
Product
Output Power Table.
2
Continuous
193 W
236 W
280 W
305 W
326 W
360 W
388 W
414 W
(25 °C)
Two-Switched Forward
1
C-A
Continuous
of <4 °C/W), measured at specified
163 W
200 W
235 W
258 W
276 W
304 W
327 W
344 W
(50 °C)
380 V
TFS757-764HG
1
228 W
278 W
309 W
358 W
383 W
407 W
455 W
530 W
(50 °C)
Peak
100 V - 400 V
Flyback
Rev. C 02/11
50 °C
20 W
20 W
20 W
20 W
20 W
20 W
20 W
20 W
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