RT8204BGQW Richtek USA Inc, RT8204BGQW Datasheet - Page 7

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RT8204BGQW

Manufacturer Part Number
RT8204BGQW
Description
IC SYNC BUCK W/LDO CTRLR 16WQFN
Manufacturer
Richtek USA Inc
Datasheet

Specifications of RT8204BGQW

Topology
Step-Down (Buck) Synchronous (1), Linear (LDO) (1)
Function
Any Function
Number Of Outputs
2
Voltage/current - Output 1
Controller
Voltage/current - Output 2
Controller
W/led Driver
No
W/supervisor
No
W/sequencer
No
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-WFQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
DS8204B-03 March 2011
PGOOD (upper side threshold decide by OV threshold)
Trip Threshold (Falling)
Fault Propagation Delay
Output Low Voltage
Leakage Current
LDO Controller
Quiescent Current
Shut-down Current
Input Voltage UVLO
LEN Logic High Voltage
LEN Logic Low Voltage
LEN Input Current
LFB Reference Voltage
LFB Input Current
LDRV Output
Current
Output UVP Threshold
UVP Propagation Delay
PGOOD Threshold (Falling)
PGOOD Propagation Delay
PGOOD Low Voltage
PGOOD Leakage Current
Thermal Shutdown
Thermal Shutdown
Hysteresis
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
JEDEC 51-3 thermal measurement standard.
Parameter
JA
is measured in the natural convection at T
Sourcing
Sinking
I
I
V
V
I
V
I
I
I
Q
SHDN
LEN
LFB
LDRV_sr
LDRV_sk
Symbol
LEN_H
LEN_L
LFB
Measured at FB with respect to
reference, no load. Hysteresis = 3%
Falling edge, FB forced below
PGOOD trip threshold
I
High state, forced to 5V
PWM off, LDO on, I
LEN = 5V (Internal pull low)
V
V
Measured at LFB pin
Measured at LFB pin
Falling edge, FB forced below
PGOOD trip threshold
I
High state, forced to 5V
SINK
SINK
LFB
LFB
= 0.72V
= 0.78V
= 1mA
= 1mA
The case point of θ
Test Conditions
A
= 25°C on a low effective thermal conductivity test board of
OUT
= 0mA
JC
is on the expose pad for the WQFN package.
0.739
Min
−13
4.1
1.4
1.4
−1
40
87
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2
0.75
Typ
−10
155
2.5
2.5
2.5
50
90
10
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--
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2
2
RT8204B
0.761
www.richtek.com
Max
400
0.4
4.5
0.8
0.4
−7
10
60
93
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1
5
1
1
Unit
mA
μA
μA
μA
μA
μA
μA
μs
μs
μs
°C
°C
%
%
%
V
V
V
V
V
V
7

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