TDA7492MV13TR STMicroelectronics, TDA7492MV13TR Datasheet - Page 26

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TDA7492MV13TR

Manufacturer Part Number
TDA7492MV13TR
Description
IC AMP AUD CLASS D BTL PWRSSO36
Manufacturer
STMicroelectronics
Type
Class Dr
Datasheet

Specifications of TDA7492MV13TR

Output Type
1-Channel (Mono)
Max Output Power X Channels @ Load
50W x 1 @ 6 Ohm
Voltage - Supply
5 V ~ 18 V
Features
Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type
Surface Mount
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-11059-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TDA7492MV13TR
Manufacturer:
ST
0
Part Number:
TDA7492MV13TR
Manufacturer:
ST
Quantity:
20 000
Application information
7.9
26/28
Heatsink requirements
A thermal resistance of 24 °C/W can be obtained using the PCB copper ground layer with
16 vias connecting it to the contact area for the exposed pad. Ensure that the copper ground
area is a nominal 9 cm
Figure 27
As with most amplifiers, the power dissipated within the device depends primarily on the
supply voltage, the load impedance and the output modulation level.
The maximum estimated power dissipation for the TDA7491MV is less than 4 W. When
properly mounted on the above PCB the junction temperature could increase by 96 °C.
However, with a musical program the dissipated power is about 40% less, leading to a
temperature increase of around 60 °C. Even at the maximum recommended ambient
temperature for consumer applications of 50 °C there is still a clear safety margin before the
maximum junction temperature (150 °C) is reached.
Figure 27. Power derating curves for PCB used as heatsink
Pd (W)
shows the derating curves for copper areas of 4 cm
8
7
6
5
4
3
2
1
0
0
Copper Area 2x2 cm
and via holes
2
for 24 °C/W.
20
Doc ID 14576 Rev 2
Copper Area 3x3 cm
and via holes
40
60
Tamb ( °C)
80
g
100
2
and 9 cm
TDA7491P
PSSO36
TDA7491MV
PowerSSO-36
120
2
.
140
TDA7491MV
160

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