PCA9601DP,118 NXP Semiconductors, PCA9601DP,118 Datasheet - Page 25

• Manufacturer Part Number: PCA9601DP,118
• Description: IC DUAL BI-DIR BUS BUFFER 8-TSSO
• Manufacturer: NXP Semiconductors

Specifications of PCA9601DP,118

• Number Of Channels Per Chip: 2
• Supply Voltage (max): 15 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-8
• Interface: I2C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-5302-2

NXP Semiconductors
Fig 28. Package outline SOT505-1 (TSSOP8)
PCA9601_1
Product data sheet
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT505-1
max.
1.1
A
0.15
0.05
A 1
1
0.95
0.80
8
A 2
y
pin 1 index
IEC
e
Z
0.25
A 3
D
0.45
0.25
b p
b p
5
4
All information provided in this document is subject to legal disclaimers.
0.28
0.15
JEDEC
c
0
w
REFERENCES
M
D
3.1
2.9
(1)
Rev. 01 — 28 May 2010
E
3.1
2.9
(2)
c
JEITA
scale
0.65
2.5
A 2
e
A 1
H E
5.1
4.7
0.94
L
5 mm
H E
E
detail X
0.7
0.4
L p
L
0.1
v
L p
PROJECTION
EUROPEAN
Dual bidirectional bus buffer
0.1
w
A
(A 3 )
0.1
X
y
θ
v
A
M
PCA9601
0.70
0.35
Z
© NXP B.V. 2010. All rights reserved.
A
(1)
ISSUE DATE
99-04-09
03-02-18
6°
0°
θ
SOT505-1
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