STM32F107RCT6TR STMicroelectronics, STM32F107RCT6TR Datasheet - Page 84

IC ARM CORTEX MCU 256KB 64LQFP

STM32F107RCT6TR

Manufacturer Part Number
STM32F107RCT6TR
Description
IC ARM CORTEX MCU 256KB 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F107RCT6TR

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LFQFP
Core
ARM Cortex M3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F107RCT6TR
Manufacturer:
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Quantity:
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Part Number:
STM32F107RCT6TR
Manufacturer:
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0
Package characteristics
6.2
6.2.1
84/101
Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
P
taking into account the actual V
application.
Table 60.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O
JA
JA
max represents the maximum power dissipation on output pins where:
T
P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
T
INT
) + ((V
J
Doc ID 15274 Rev 5
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
35.
/ I
OH
D
OH
),
max × 
D
of the I/Os at low and high level in the
max = P
STM32F105xx, STM32F107xx
JA
)
INT
max + P
Value
46
45
40
46
45
I/O
max),
°C/W
°C/W
Unit

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