BGS 12AL7-4 E6327 Infineon Technologies, BGS 12AL7-4 E6327 Datasheet - Page 5

• Manufacturer Part Number: BGS 12AL7-4 E6327
• Description: RF Switch ICs GEN PURPOSE RF MOS SWITCH
• Manufacturer: Infineon Technologies

Specifications of BGS 12AL7-4 E6327

• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 30 C
• Mounting Style: SMD/SMT
• Number Of Switches: Single
• Switch Configuration: Single SPDT
• Package / Case: TSLP
• Frequency (max): 3GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BGS12AL74E6327XT

List of Figures
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Preliminary Data Sheet
Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Measurement Results (@ T = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package TSLP7-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Board Pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
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Revision 1.3, 2009-06-24
SPDT RF Switch
BGS12AL7-4
List of Figures