FP1189-G TriQuint, FP1189-G Datasheet - Page 11

• Manufacturer Part Number: FP1189-G
• Description: RF Mixer 50-4000MHz +27dBm P1dB
• Manufacturer: TriQuint

Specifications of FP1189-G

• Frequency Range: 915 MHz to 2450 MHz
• Maximum Operating Temperature: + 160 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 8 V
• Supply Current: 125 mA
• Package / Case: SOT-89
• Noise Figure: 2.7 dB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066922

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
FP1189
½-Watt HFET
FP11G
XXXX-X
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
FP1189-G Mechanical Information
Specifications and information are subject to change without notice.
The FP1189-G will be marked with an
“FP11G” designator. An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
marked
followed by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1B
Value:
Test:
Standard:
ESD Rating: Class IV
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper
2. Add as much copper as possible to inner and outer
3. Mounting screws can be added near the part to fasten
4. Do not put solder mask on the backside of the PC board
5. RF trace width depends upon the PC board material
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
Mounting Config. Notes
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
layers near the part to ensure optimal thermal
performance.
the board to a heatsink.
thermal via region contacts the heatsink.
in the region where the board contacts the heatsink.
and construction.
in degrees.
MSL / ESD Rating
Product Marking
with
The obsolete tin-lead package is
Passes /500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 2000 V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020
an
“FP1189”
Page 11 of 11
Ensure that the ground /
designator
January 2008